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CU4273 Tin-Plated Copper Foil

Catalogue Number CU4273
Dimensions Customized
Thickness 12μm, or customized
Operating Temperature 20-120℃
Purity Cu 99.9%

Tinned Copper Film is suitable for EMI shielding in the low-frequency range. Stanford Advanced Materials (SAM) has extensive experience in the manufacturing and supply of high-quality tinning copper films.

Related products: Gold-Plated Polyimide Film, Oxygen-Free Copper Foil/Tape, Conductive Carbon-Coated Copper Film

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