Description
Copper-Zinc (Cu/Zn) evaporation materials are essential components in vacuum coating processes and are composed of copper and zinc alloys. They provide configurable electrical and thermal properties that meet the requirements for various thin film deposition applications. Copper delivers an electrical conductivity value that supports semiconductor device manufacturing, and zinc alloys supply predetermined alloy properties. The materials are utilised in semiconductor devices, metallisation coatings and thermal management systems. Their composition permits precise control of film deposition, thereby meeting the technical standards in electronic and energy sectors.
Specification
Materials
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Copper, Zinc
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Density
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7.0–9.0 g/cm³
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Melting Point
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900–1 100 °C
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Purity
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99.9%
|
Applications
1. Semiconductor Industry: Metallisation layers, contacts and conductive tracks are produced in semiconductor device manufacturing to meet performance and stability requirements.
2. Electronic Devices: Metallised coatings, contacts and conductive tracks are fabricated for printed circuit boards, touchscreens and electronic displays.
3. Thermal Management Systems: The materials are employed as heat transfer media or heat sinks to control operating temperatures in electronic and optoelectronic devices, thereby maintaining thermal regulation.
4. Optical Coatings: Thin films with specific optical properties are deposited for mirrors, lenses and optical filters.
5. Metal Coatings: Surface coatings are applied to increase corrosion resistance and mechanical strength of metal parts.
Packaging
Our Copper-Zinc (Cu/Zn) evaporation materials are clearly marked for effective identification and quality control. Measures are taken during storage and transport to prevent damage.