Description of Boron Nitride Evaporation Materials
Boron Nitride (BN)-Evaporation materials are important components used in thin-film deposition processes, particularly in the semiconductor, optical and aerospace industries. They are valued for their thermal stability, electrical insulation properties and resistance to high temperatures, which makes them suitable for various applications.
Specifications for Boron Nitride Evaporation Materials
Property |
Value |
Material Type |
Boron Nitride |
Symbol |
BN |
Appearance/Colour |
White |
Melting Point |
Ca. 2 973°C (5 383°F) |
Density |
2.1 g/cm³ |
Purity |
99.9% |
Form |
Powder/Granulate/Custom fabrication |
Typical Applications for Boron Nitride Evaporation Materials
- Electronic components – heat sinks, substrates, coil bodies, prototypes
- Boron-doped wafers in silicon semiconductor processing
- Vacuum melting crucibles
- CVD crucibles
- Packaging of microcircuits
- Sputter targets
- High-precision sealing, soldering and metallisation devices
- Microwave tubes
- Horizontal roller brake rings
- Low friction seals
- Plasma arc isolators
- Mountings and supports for high-temperature furnaces
- Various types of components for semiconductor manufacturing equipment
- Metal/glass moulding/corrosion-resistant material
- Fittings for the assembly of electronic components
- Isolation elements for electric furnaces
Customised Boron Nitride Evaporation Materials
Stanford Advanced Materials recognises the importance of precise specifications for many applications. We offer customisation options for Boron Nitride Evaporation Materials, including specific forms, sizes and purity levels, which are tailored to your requirements.
Packaging of Boron Nitride Evaporation Materials
Our Boron Nitride evaporation materials are packaged carefully to maintain their quality and integrity during transport and storage. We ensure that damage is prevented during handling and delivery.