AL10262 Sapphire Wafer Al2O3 M plane 0.5 inch x 0.5 inch x 0.5 mm

Sapphire Wafer Al2O3 M plane 0.5 inch x 0.5 inch x 0.5 mm Description

Sapphire Wafer Al2O3 M plane 0.5 inch x 0.5 inch x 0.5 mm is composed of high-purity aluminium oxide (Al2O3) with a defined M-plane orientation. The substrate’s dimensions ensure compatibility with precision processing equipment. Its micro-scale flatness supports accurate deposition and lithographic patterning in semiconductor and optical applications. Rigorous surface metrology and defect evaluation guarantee consistent crystallographic quality, aiding advanced material research and production processes.

Sapphire Wafer Al2O3 M plane 0.5 inch x 0.5 inch x 0.5 mm Applications

1.       Electronics
- Used as a substrate in semiconductor devices to enhance epitaxial layer uniformity by leveraging the wafer's controlled M-plane orientation.
- Applied as an insulating layer in microelectronic circuits to achieve optimal electrical isolation through its chemical inertness.

2.       Optical Systems
- Serves as a base for optical coatings in high-resolution sensors to manage light reflectivity by utilising its high transparency and homogeneous structure.
- Frequently used in laser components to stabilise optical paths, benefiting precision alignments during fabrication processes.

Sapphire Wafer Al2O3 M plane 0.5 inch x 0.5 inch x 0.5 mm Packing

The wafer is secured in an anti-static carrier and enclosed in a rigid protective case lined with foam inserts. Storage conditions require a clean, low-humidity environment to prevent particulate contamination and surface degradation. Custom packaging options, including vacuum-sealed pouches and moisture barrier bags, are also available to accommodate specific storage and transport requirements.

Frequently Asked Questions

Q1: What role does the M-plane orientation play in device fabrication?
A1: The M-plane orientation influences directional properties during film deposition, facilitating uniform growth and reducing anisotropic stress in devices. This feature is critical for processes requiring precise layer uniformity.

Q2: How does the wafer’s micro-scale flatness impact semiconductor processing?
A2: The micro-scale flatness minimises surface irregularities, which is essential in photolithography and etching processes. This accuracy enhances pattern fidelity and reduces process variability.

Q3: What quality control measures are implemented during production?
A3: Advanced surface metrology techniques, such as atomic force microscopy and optical profilometry, are employed to monitor flatness and defect density. These checks ensure the wafer meets stringent dimensional and crystallographic criteria.

Additional Information

Aluminium oxide (Al2O3) substrates are widely used in various research and industrial fields due to their chemical inertness and high thermal stability. They find applications in electronics, optical systems, and sensor technologies where precise surface characteristics are required. The M-plane orientation in sapphire wafers offers specific advantages in achieving uniform thin film deposition and reduced surface roughness.

In materials science, ongoing research emphasises the importance of controlled crystallographic orientations to optimise device performance. High-purity sapphire substrates, processed with techniques like chemical vapour deposition, continue to drive advancements in semiconductor technology and optical component fabrication.