BN10075 Hot Pressed Boron Nitride Spacer, BN Spacer

Hot Pressed Boron Nitride Spacer, BN Spacer Description

Hot Pressed Boron Nitride Spacer, BN Spacer is produced using a high-pressure, high-temperature pressing technique to ensure an inert, high-purity BN ceramic material. With a composition maintained at ≥99% purity and a density of 1.9-2.2 g/cm³, the spacer provides stable dimensional control and performance consistency. Customisable dimensions allow precise integration into assemblies, while the material’s inherent thermal stability supports applications in environments with elevated operating temperatures.

Hot Pressed Boron Nitride Spacer, BN Spacer Applications

Electronics and Semiconductor Applications
- Used as a spacer in chip packaging to achieve controlled thermal isolation by leveraging BN’s high purity and dimensional precision.
- Applied as an insulating element in circuit assembly fixtures to maintain spacing integrity by utilising the material's controlled density.

Industrial and High-Temperature Systems
- Used as a component in furnace insulation assemblies to achieve effective thermal separation by utilising the material’s stable density.
- Applied as a spacer in high-temperature processing equipment to maintain precise gap settings by leveraging customisable dimensions.

Hot Pressed Boron Nitride Spacer, BN Spacer Packing

Hot Pressed Boron Nitride Spacer, BN Spacer is packaged using inert protective materials and sealed in moisture barrier pouches. The spacers are arranged in rigid, cushioned containers to mitigate mechanical shock and contamination. Storage recommendations include a dry, temperature-controlled environment. Customised packaging options, such as individual compartmentalisation and labelling, are available for enhanced handling and transport.

Frequently Asked Questions

Q1: How does the controlled density range (1.9-2.2 g/cm³) affect the spacer's mechanical performance?
A1: The controlled density range contributes to predictable compressive behaviour and dimensional stability. This consistency is critical during high-temperature operations, where uniform mechanical properties minimise deformation and support precise assembly tolerances.

Q2: What technical measures does SAM utilise during fabrication of these BN spacers?
A2: SAM implements systematic density verification and microstructural analysis through scanning electron microscopy to assess homogeneity and composition. These measures ensure that each spacer meets the specified density, purity, and performance criteria required for critical thermal applications.

Q3: Can customised dimensions impact the thermal management capabilities of the spacer?
A3: Yes, customisation of dimensions enables precise integration into various systems, optimising heat dissipation and insulation. Tailored spacer sizes help align with specific thermal profiles, improving overall efficiency in managing high-temperature environments.

Additional Information

Boron Nitride exhibits unique properties, including high chemical inertness and thermal stability, which make it suitable for applications requiring precision and durability under thermal stress. The material’s crystalline structure supports excellent electrical insulation and low thermal expansion, characteristics essential for maintaining performance in high-stress environments.

Understanding the relationship between material purity, density, and processing conditions is key in materials science. These factors collectively determine the physical properties and application range of BN ceramics, offering engineers the option to customise components to meet stringent operational requirements in electronic, industrial, and high-temperature systems.