CM9157 Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material

Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material Description

Experience the performance of our Aluminium Diamond/Copper Diamond (Al-Dia/Cu-Dia) composite material, engineered to combine the thermal conductivity and hardness of diamond with the versatility of aluminium or copper. By utilising diamond’s heat dissipation and abrasion resistance, this composite delivers strength, thermal stability, and reduced weight. The result is a solution ideal for high-performance applications in aerospace, electronics, and precision manufacturing.

Produced under strict quality standards, our Al-Dia/Cu-Dia composite undergoes testing for purity, homogeneity, and durability. This ensures a consistent microstructure that maintains integrity even under extreme conditions. Count on our composite for long-lasting performance that meets the demands of industrial and technological advancements.

Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material Applications

Aluminium Diamond/Copper Diamond (Al-Dia/Cu-Dia) composite materials are recognised for their thermal conductivity, mechanical strength, and lightweight properties, making them candidates across diverse industries. Their structures, combined with low density, offer efficiency benefits for applications requiring heat dissipation and structural integrity. Below are areas where these composite materials can be effectively utilised.

1. Thermal Management Solutions

·         Heat spreaders in microelectronics, leveraging the composite’s thermal conductivity for cooling.

·         Heat exchanger components for industrial systems, reducing weight while improving thermal performance.

·         Thermal interface substrates for power modules, enhancing reliability under operating temperatures.

2. Aerospace and Defence

·         Lightweight structural panels for aircraft and spacecraft, improving fuel efficiency and payload capacity.

·         Protective armour systems, utilising the composite’s shock-resistant properties for ballistic protection.

·         Satellite components for improved thermal regulation and durability in environments.

3. Electronics and Energy

·         Power electronics housings, ensuring performance by dissipating heat effectively in compact designs.

·         Battery pack enclosures for electric vehicles, combining robustness with minimal weight.

·         High-power laser system bases, capitalising on thermal stability for reliable operation.

Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material Packaging

These Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) composites are shipped in vacuum-sealed, moisture-resistant wrapping, surrounded by foam to prevent damage. For optimal preservation, store them in a clean, climate-controlled environment, away from sunlight and temperatures. Anti-contamination precautions include sealed packaging and inspections before dispatch. Customisable packaging options—such as specific sizes, protective liners, or tamper-evident seals—ensure protection to customers’ requirements.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material FAQs

Q1: What are the key material properties of Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material?

A1: AI-Dia/Cu-Dia composite materials exhibit thermal conductivity, low coefficient of thermal expansion, and mechanical strength due to integrated diamond reinforcement. The aluminium or copper matrix offers machinability and corrosion resistance, while diamond particles provide hardness and abrasion resistance. These properties make the composite suitable for electronics, aerospace applications, and machinery components.

Q2: How should this product be handled and stored to maintain performance?

A2: Proper handling of AI-Dia/Cu-Dia composite materials involves using gloves to prevent contamination and suitable cutting tools for metal/diamond mixtures. Storage in a clean, dry environment is crucial to minimise oxidation or moisture absorption. Avoid exposing the composite to extreme temperatures or thermal shocks that could compromise integrity. Maintaining humidity and temperature levels helps preserve mechanical properties and extends operational lifespan.

Q3: Which quality standards and certifications apply to Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) Composite Material?

A3: AI-Dia/Cu-Dia composite materials are manufactured following ISO 9001 quality management guidelines to ensure production and traceability. In aerospace and electronics, certifications like AS9100 or MIL-STD compliance may be required to validate performance under conditions. Manufacturers conduct in-house testing for thermal conductivity, tensile strength, and stability. Compliance with RoHS directives can also be relevant for sensitive applications.

Related Information

1. Material Properties and Advantages

Melding high thermal conductivity with mechanical strength, Aluminium Diamond/Copper Diamond (AI-Dia/Cu-Dia) composite material stands out for its heat dissipation capabilities. This composite utilises diamond particles, which are embedded in either an aluminium or copper matrix, to reduce hotspots and enhance reliability in environments. By maintaining efficiency under temperatures, AI-Dia/Cu-Dia ensures performance in applications that require thermal management.

In addition to heat transfer attributes, AI-Dia/Cu-Dia offers structural rigidity without increasing weight. The integration of diamond particles fortifies the composite, providing strength and mass. Thanks to this composition, the material is prized in sectors where weight-to-performance ratios and thermal stability are considerations.

2. Applications in Advanced Industries

Employing AI-Dia/Cu-Dia composite material has become popular in aerospace, satellite, and defence applications, where heat dissipation and system integrity are crucial. This composite handles thermal loads helps maintain operating conditions, enhancing equipment longevity and success. From satellites requiring thermal control to fighter jets encountering temperature shifts, AI-Dia/Cu-Dia addresses the demands of transportation and exploration technologies.

Cross-industry adoption continues to grow as electronic device manufacturers and semiconductor producers discover the benefits of this material’s conductivity and thermal expansion. AI-Dia/Cu-Dia substrates are advantageous for power electronic modules, laser packaging, and systems, providing a thermal pathway while resisting mechanical failures. By delivering durability and performance, this composite paves the way for reliable solutions in a technological landscape.