CM9163 Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate

Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate Description

This Gold-Plated Aluminium Silicon Carbide (AlSiC) Heat Sink Plate offers exceptional thermal management and structural integrity for high-performance electronic applications. The AlSiC composite delivers excellent thermal conductivity while maintaining a lightweight, rigid form, ensuring reliable heat dissipation. Its gold-plated surface further enhances corrosion resistance and electrical conductivity, making it ideal for critical environments that demand consistent and robust performance.

Engineered to meet stringent industry standards, this heat sink plate is manufactured under strict quality controls to guarantee long-term reliability. Its low coefficient of thermal expansion helps reduce stress on components, preventing premature failures. Whether used in aerospace, telecommunications, or power electronics, this AlSiC heat sink plate provides dependable heat spreading solutions backed by high-quality material properties and precise craftsmanship.

Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate Applications

Gold-Plated Aluminium Silicon Carbide (AlSiC) Heat Sink Plate is a specialised thermal management component that combines the lightweight strength of aluminium, the high thermal conductivity of silicon carbide, and the added benefits of gold plating. This unique construction ensures superior heat dissipation, corrosion resistance, and reliability in demanding environments. It is particularly beneficial for precision applications that require stable performance under extreme temperatures and high mechanical stress.

1. Aerospace Applications

·         Ideal for managing heat in satellite power modules, providing reliable performance in vacuum conditions

·         Efficiently dissipates heat in propulsion control systems to enhance overall vehicle reliability

2. Electronics Applications

·         Optimises thermal management for advanced computing boards operating under high loads

·         Ensures stable heat conduction in densely packed microelectronic devices, extending their operational lifespan

3. Defence Applications

·         Provides robust thermal regulation for military radar systems exposed to harsh field conditions

·         Enhances heat dissipation in mission-critical communication devices to maintain consistent performance

Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate Packaging

Each gold-plated Aluminium Silicon Carbide AlSiC heat sink plate is carefully enveloped in static-dissipative foam and sealed in moisture-resistant bags. Proper storage conditions include a clean, temperature-controlled environment free of contaminants. Anti-contamination measures encompass careful handling and prompt resealing after inspection. Custom packaging options, such as labelled pouches or reinforced cartons, ensure secure transport and organisation. These measures maintain the plate’s pristine surface finish and structural integrity, supporting effective thermal management applications.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate FAQs

Q1: What are the key material properties of Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate?

A1: AlSiC is a metal matrix composite composed of aluminium and silicon carbide, known for matching the coefficient of thermal expansion to many semiconductor materials. The gold plating adds excellent corrosion resistance and enhances solderability for reliable device integration. This heat sink plate provides high thermal conductivity, good mechanical strength, and low density, making it well-suited for demanding electronic applications. Its dimensional stability also helps maintain tight tolerances in high-performance designs.

Q2: How should this product be handled and stored?

A2: Gold-Plated AlSiC Heat Sink Plates should be handled with clean gloves or approved handling tools to prevent contamination and surface damage. Avoid bending or applying excessive force, as the composite structure and gold coating can be sensitive to mechanical stress. Store these plates in a moisture-controlled environment, using sealed packaging or protective containers to preserve gold plating integrity and maintain optimal thermal and mechanical performance.

Q3: Which quality standards and certifications apply to Gold-Plated Aluminium Silicon Carbide AlSiC Heat Sink Plate?

A3: These heat sink plates typically adhere to rigorous manufacturing and inspection standards, such as ISO 9001 for quality management and ISO 14001 for environmental practices. Additional compliance with RoHS ensures minimal hazardous substances, while AS9100 may apply for aerospace or high-reliability applications. The gold plating thickness and purity can be certified under ASTM B488 guidelines, confirming adherence to strict performance requirements in demanding electronic environments.

Related Information

1. Industry Standards and Certifications

Throughout the electronics sector, Gold-Plated Aluminium Silicon Carbide (AlSiC) heat sink plates must satisfy rigorous requirements to guarantee reliable performance under demanding conditions. Many organisations, including the International Electrotechnical Commission (IEC) and the American Society for Testing and Materials (ASTM), have created specialised benchmarks to assess thermal management components. These guidelines ensure that thermal conductivity, coefficient of thermal expansion, and mechanical resilience meet predefined performance thresholds. By complying with these standards, manufacturers can offer end-users the assurance that each AlSiC heat sink plate is both safe and effective for mission-critical applications.

Adherence to certifications such as ISO 9001 further underscores the commitment to stringent quality and process controls in producing these gold-plated solutions. This level of accreditation verifies that every stage of manufacturing meets defined criteria, from the bonding of the aluminium and silicon carbide layers to the final gold electroplating. In this way, each unit fulfils the high reliability demanded by industries including telecommunications, defence, and aerospace, while ensuring consistent results across multiple production batches.

2. Applications in Advanced Industries

Growing market demands for powerful, compact electronic systems have led to widespread use of Gold-Plated AlSiC heat sink plates in advanced fields. Their remarkable thermal management properties, combined with the corrosion-resistant gold coating, make them indispensable in areas such as satellite communications, avionics, and high-performance computing. By efficiently dissipating heat over a controlled area, these plates enable sensitive components to function within safe temperature ranges, reducing wear and improving overall system longevity.

Combining exceptional thermal conductivity with lightweight construction also positions these heat sink plates as prime solutions for medical imaging devices and semiconductor capital equipment. The reduced mass helps minimise vibration and stress on high-precision assemblies, while the stable interface between aluminium and silicon carbide ensures consistent thermal transfer over an extended operational life. As advanced industries push for even faster data processing speeds and more reliable performance, Gold-Plated AlSiC heat sink plates continue to excel as a trusted, high-quality option for thermal management.