CM9165 Aluminum Silicon Carbide AlSiC Heat Sink Plate

Aluminium Silicon Carbide AlSiC Heat Sink Plate Description

Aluminium Silicon Carbide (AlSiC) Heat Sink Plates combine the lightweight properties of aluminium with the high stiffness and thermal conductivity of silicon carbide. This results in a low coefficient of thermal expansion (CTE), ensuring reliable compatibility with various semiconductor materials. Thanks to their high thermal diffusivity, these plates effectively dissipate heat in high-power devices, maintaining optimal operating temperatures and reducing the risk of component failures.

Ideal for aerospace, automotive, and telecommunications applications, AlSiC Heat Sink Plates are manufactured to strict quality standards, including tight dimensional tolerances and strong mechanical integrity. Each plate undergoes thorough testing to meet ISO and industry-specific certifications, guaranteeing consistent performance and long service life. Whether used in power modules or advanced computing systems, AlSiC provides a dependable solution for demanding thermal management needs.

Aluminium Silicon Carbide AlSiC Heat Sink Plate Applications

Aluminium Silicon Carbide (AlSiC) heat sink plates combine the lightweight and thermal conductivity of aluminium with the high mechanical strength of silicon carbide. This thermal management solution offers a balance of low density and efficient heat dissipation, making it ideal for high-performance applications. In addition, AlSiC stability and rigidity help protect sensitive components during demanding operational conditions.

1. Industrial Applications

·         Application 1: Ideal for power electronics in automotive systems, where AlSiC’s high thermal conductivity and low coefficient of thermal expansion enhance reliability.

·         Application 2: Suitable for heavy machinery control units, utilising its rigid structure to maintain performance under extreme load and temperature conditions.

2. Research Applications

·         Application 1: Used in advanced laboratory instruments requiring efficient heat dissipation for sensitive detectors and measurement components.

·         Application 2: Integrated into energy storage prototypes to handle high-power cycling without sacrificing stability.

3. Commercial Applications

·         Application 1: Ensures consistent thermal management for telecommunications equipment, preventing overheating in compact electronic modules.

·         Application 2: Used in consumer electronics power modules, leveraging its lightweight design for cost-effective, high-volume products.

Aluminium Silicon Carbide AlSiC Heat Sink Plate Packaging

Aluminium Silicon Carbide (AlSiC) Heat Sink Plates are packaged with protective foam liners and anti-static barriers to guard against impact and electrostatic discharge. A sealed, moisture-resistant enclosure prevents corrosion, while desiccant packets maintain dryness. For optimal storage, keep plates in a clean, temperature-controlled environment to minimise contamination risks. Customised packaging options, including labelling and branding, are available to meet client specifications.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Aluminium Silicon Carbide AlSiC Heat Sink Plate FAQs

Q1: What are the key material properties of Aluminium Silicon Carbide AlSiC Heat Sink Plate?

A1: Aluminium Silicon Carbide (AlSiC) heat sink plates typically exhibit low density, high thermal conductivity, and a closely matched coefficient of thermal expansion (CTE) to semiconductor materials. The high strength and stiffness derived from silicon carbide reinforcement provides excellent mechanical durability. Additionally, AlSiC shows good dimensional stability under extreme temperatures, making it suitable for power modules, aerospace systems, and other thermal management applications.

Q2: How should this product be handled and stored?

A2: When handling AlSiC heat sink plates, use clean, lint-free gloves to avoid contamination and scratches. Store them in a dry, temperature-controlled area with proper packaging to prevent moisture absorption and reduce mechanical shock. Avoid exposing the plates to harsh chemicals or excessive vibrations. Conduct visual inspections before installation to identify any potential surface defects or cracks that may affect performance.

Q3: Which quality standards and certifications apply to Aluminium Silicon Carbide AlSiC Heat Sink Plate?

A3: AlSiC heat sink plates are often manufactured in accordance with ISO 9001 quality management standards, ensuring consistent processes and product traceability. AS9100 certifications may also apply, especially for aerospace applications requiring rigorous testing. In some instances, MIL-STD compliance for thermal performance or mechanical durability is relevant. Additionally, RoHS and REACH directives can govern material composition, confirming environmental compatibility and safe manufacturing practices.

Related Information

1. Material Properties and Advantages

Aluminium Silicon Carbide (AlSiC) heat sink plates are recognised for their thermal and mechanical characteristics. These composite plates exhibit a balanced coefficient of thermal expansion, closely matching that of semiconductor materials, thereby minimising thermal stress in high-power electronic applications. Their low density also makes them suitable in weight-sensitive systems such as aerospace equipment and satellite components. The distinct interface bonding between aluminium and silicon carbide particles results in a strong structure able to withstand significant mechanical forces without compromising thermal efficiency.

Due to their inherent thermal conductivity, AlSiC heat sink plates dissipate heat more effectively than conventional metals. This advantage leads to improved performance and reliability for applications demanding strict heat regulation. Furthermore, the controlled microstructure of AlSiC composites contributes to consistent performance under prolonged thermal cycling conditions, ensuring extended operational life for sensitive electronics. As a result, these plates can reduce the need for additional cooling mechanisms and protect critical devices from overheating in high-demand operating environments.

2. Applications in Advanced Industries

Industries including high-speed computing, electric vehicles, and renewable energy integrate AlSiC heat sink plates into their core technologies. The material’s ability to dissipate heat efficiently while maintaining mechanical strength allows power modules and electronic control units to function with increased stability and reduced risk of thermal damage. Engineers also utilise these plates in laser systems and microwave components, where even minor temperature fluctuations can degrade performance over time.

Demonstrating durability under demanding load conditions, AlSiC heat sink plates have become important in aerospace propulsion management systems and specialised defence applications. Their lightweight nature aids optimal payload distribution without sacrificing performance, which is particularly important in the design of satellites and advanced radar modules. By effectively controlling temperature fluctuations, these plates offer high reliability and support devices operating within a secure thermal range, ultimately enhancing overall system quality and longevity.