CU9158 Copper/Molybdenum-Copper/Copper (CPC) Material

Copper/Molybdenum-Copper/Copper (CPC) Material Description

Copper/Molybdenum-Copper/Copper (CPC) is a composite material known for its high thermal management and mechanical strength capabilities. By combining layers of copper and molybdenum-copper, CPC optimises conductivity while significantly reducing thermal expansion, making it suitable for high-performance applications such as semiconductor devices and power modules. This versatile combination also exhibits strong bonding properties, ensuring reliable performance under extreme conditions and extended service life.

Thanks to strict adherence to industry standards like IPC and ISO, CPC material consistently meets strict quality and performance requirements. Its composition and tightly controlled manufacturing processes guarantee uniform thickness, excellent flatness, and minimal warpage. Whether utilised in aerospace electronics, automotive systems, or advanced communications equipment, CPC offers an optimum balance of durability, thermal stability, and precision—supporting demanding technological applications.

Copper/Molybdenum-Copper/Copper (CPC) Material Applications

Copper/Molybdenum-Copper/Copper (CPC) is a high-performance composite known for its high thermal conductivity, mechanical stability, and low thermal expansion. This advanced material is engineered to withstand extreme temperatures, making it suitable for demanding applications in various industries. With its exceptional heat dissipation capabilities and strong structural integrity, CPC ensures reliable performance, prolonged component lifespans, and maximised efficiency in various advanced technologies.

1. Electronic Packaging and Thermal Management

·         Application 1: Heat sinks for high-power microprocessors, delivering efficient cooling and improved component longevity.

·         Application 2: Substrates in power modules, ensuring stable performance under intense thermal cycling.

2. Aerospace and Defence

·         Application 1: Satellite communication components, providing enhanced thermal control in extreme orbital environments.

·         Application 2: Missile guidance systems, offering high reliability and reduced thermal stress for sensitive electronics.

3. Optical and Laser Systems

·         Application 1: Laser diode mounting, enabling accurate beam alignment and efficient heat transfer.

·         Application 2: Precision optical mirrors, maintaining dimensional stability even under rapid temperature fluctuations.

Copper/Molybdenum-Copper/Copper (CPC) Material Packaging

CPC materials are securely wrapped with protective foam or bubble wrap, then vacuum-sealed to prevent exposure to moisture or contaminants. For extended shelf life, we recommend storing in a clean, dry environment, away from direct sunlight and corrosive substances. Anti-contamination measures such as sealed containers and desiccants ensure optimal preservation. Customisable packaging solutions, including size-specific inserts and tamper-evident seals, are available to accommodate various shipping and handling requirements.

Packaging: Vacuum sealed, Wooden Box, or Customised.

Copper/Molybdenum-Copper/Copper (CPC) Material FAQs

Q1: What are the key material properties of Copper/Molybdenum-Copper/Copper (CPC) Material?

A1: Copper/Molybdenum-Copper/Copper (CPC) material possesses high thermal conductivity, mechanical stability, and a low coefficient of thermal expansion. It combines the high heat dissipation of copper with the rigidity of molybdenum-copper, making it suitable for applications requiring reliable heat management. The structure maintains good electrical conductivity, resists thermal cycling fatigue, and shows excellent corrosion resistance, ensuring component longevity and stable performance in demanding environments.

Q2: How should this product be handled and stored?

A2: CPC material should be handled with clean gloves to prevent contamination and potential oxidation. Avoid exposure to extreme humidity and store it in a controlled environment, ideally sealed in anti-static or moisture-barrier packaging. Use suitable protective films to prevent scratches or surface damage. Implement careful stacking protocols, ensuring minimal mechanical stress. Regularly inspect stored materials for signs of corrosion or physical defects before use.

Q3: Which quality standards and certifications apply to Copper/Molybdenum-Copper/Copper (CPC) Material?

A3: In manufacturing CPC material, adherence to ISO 9001 ensures consistent product quality and traceability throughout the production process. Many suppliers also comply with AS9100 when serving aerospace and defence industries, addressing strict requirements for reliability and safety. RoHS (Restriction of Hazardous Substances) compliance is often crucial, reflecting the need to minimise hazardous materials. Additionally, materials may undergo stringent in-house inspections and third-party certifications to validate specification conformance.

Related Information

1. Manufacturing Process

Copper/Molybdenum-Copper/Copper (CPC) material is produced through a precisely controlled sequence of deposition and bonding operations. This involves layering pure copper foils with molybdenum-copper sheets using an advanced rolling or pressing technique, ensuring uniform adhesion between the different metallic layers. During the lamination stage, critical parameters such as heat input, pressure, and bonding time are monitored to achieve optimal density and grain structure in each layer. As a result, the final CPC material exhibits high thermal conductivity and mechanical strength.

In many modern manufacturing environments, automated equipment is employed to maintain consistent thickness profiles and reduce the risk of contamination. Specialized surface treatments are also utilised to enhance both inter-layer bonding and oxidation resistance, resulting in a stable, long-lasting composite. These abstract engineered processes make CPC suitable for various high-performance applications, including microelectronics, power distribution modules, and aerospace components that demand reliable thermal control under extreme conditions.

2. Comparative Analysis with Alternative Materials

Through direct comparison with standalone copper or aluminium-copper alloys, CPC stands out by exhibiting a balanced combination of thermal conduction and structural stability. While pure copper delivers excellent heat dissipation, it is susceptible to softer mechanical properties, which can limit its performance in demanding environments. Similarly, aluminium-copper composites may be less dense but often lack the strength and reliability that CPC can consistently provide over extended service lifetimes.

Alongside its high strength-to-weight ratio, CPC offers higher resistance to fatigue and thermal expansion mismatches. As a result, it provides enhanced dimensional stability compared to other common materials used in heat sink applications. For the high-precision industries that rely on strict specifications—such as telecommunications, avionics, and advanced semiconductor packaging—CPC proves to be a more reliable solution that ensures efficient heat transfer without sacrificing mechanical resilience.