CU9668 Electronic Lead Frame Strip

Electronic Lead Frame Strip Description

The Electronic Lead Frame Strip comprises a copper alloy formulated from grades C19400, C70250, C19210, C14415, and brass. Engineered for LED packaging, the material exhibits effective electrical conduction and thermal performance essential for semiconductor soldering processes. The controlled alloy composition minimises thermal expansion mismatch and supports stable interconnect performance in high-density electronic assemblies.

Electronic Lead Frame Strip Applications

Electronics
- Used as a lead frame in LED assemblies to achieve controlled electrical conduction by leveraging the alloy’s stable thermal properties.
- Applied as a thermal conductor in printed circuit boards to improve heat dissipation via its optimised copper alloy composition.

Industrial
- Employed as an interconnect in power modules to maintain stable solder joints by utilising metallurgical uniformity, thereby reducing thermal stress during operation.

Electronic Lead Frame Strip Packing

The Electronic Lead Frame Strip is packaged in anti-scratch, static-dissipative wrapping and sealed in moisture barrier bags. The product is stored in temperature-controlled containers to prevent oxidation and contamination. Packaging incorporates corrosion inhibitors and is designed to prevent mechanical damage during transit. Custom packaging options, including flat packs or roll arrangements, are available to accommodate specific handling and storage requirements.

Frequently Asked Questions

Q1: How does the controlled alloy composition impact LED performance?
A1: The controlled alloy composition ensures effective electrical conduction and thermal management, reducing thermal expansion mismatch in LED assemblies. This stability supports accurate solder joints and enhances overall device functionality.

Q2: What procedures are implemented to minimise oxidation during manufacturing?
A2: SAM conducts metallographic evaluations and compositional analysis throughout production. This process incorporates anti-corrosion treatments that help to minimise oxidation risks during soldering and subsequent assembly.

Q3: Are custom dimensions and alloy formulations available?
A3: Yes, custom dimensions and specific alloy formulations can be provided upon request to match varying LED packaging and electronic assembly requirements, ensuring material compatibility with production processes.

Additional Information

Electronic Lead Frame Strips play a critical role in semiconductor packaging, where electrical conduction and effective thermal management are essential. The careful formulation of copper alloys supports integration with modern microelectronic manufacturing methods, addressing challenges such as thermal expansion and solder joint formation.

Advances in copper alloy science expand the capacity for refined metallurgical control, aiding engineers in selecting materials that optimise performance under various operational stresses. This foundational knowledge is beneficial for the design and development of high-performance electronic assemblies and LED packaging solutions.