CU9672 Oxygen-Free Copper Strip

Oxygen-Free Copper Strip Description

Oxygen-Free Copper Strip comprises copper alloys such as C10100 and C10200, integrated with TU00, LC1011, and LC1012 to reduce oxygen impurities. The material exhibits low electrical resistivity and enhanced thermal conductivity, which are critical for precise electronic assembly. Produced in a strip form, the product allows for efficient handling and integration into circuit designs. Its controlled impurity levels support stable performance in conductive and heat management applications.

Oxygen-Free Copper Strip Applications

Electronics
- Used as a conductor in printed circuit boards to achieve efficient current flow by utilising the low resistivity of oxygen-free copper.
- Applied as interconnects in high-frequency devices to minimise signal interference by utilising the material’s refined composition.

Industrial
- Serves as a component in heat exchangers to manage thermal loads by leveraging high thermal conductivity.
- Used as bus bars in power distribution systems to reduce energy loss by applying the consistent electrical properties of the copper alloy.

Oxygen-Free Copper Strip Packing

The Oxygen-Free Copper Strip is securely packaged in anti-corrosive, moisture-resistant materials that shield against contamination. Each batch is enclosed in anti-static sleeves and sealed with barrier bags to prevent oxidation during transit and storage. The packaging supports easy handling and complies with storage requirements for sensitive electronic components. Custom packaging configurations are available to meet specific logistical and environmental standards.

Frequently Asked Questions

Q1: What quality control measures are in place to maintain compositional purity?
A1: The copper strip undergoes spectrometry analysis, along with tensile and microstructural testing, to verify that the elemental composition (including C10100, C10200, TU00, LC1011, and LC1012) meets the specified criteria. These measures help limit impurity levels and ensure consistency in performance.

Q2: Can the strip dimensions be customised for specific manufacturing processes?
A2: Yes, modifications in width, thickness, and length can be arranged. Custom dimensions are evaluated under strict process controls to ensure they meet integration requirements in manufacturing systems.

Q3: How does the oxygen-free composition affect its performance in sensitive electronics?
A3: The reduced oxygen content minimises surface oxide formation, which in turn decreases electrical resistance and prevents thermal degradation. This property is essential for maintaining stable performance in high-frequency and precision electronic circuits.

Additional Information

Copper alloys with controlled oxygen levels are critical in applications where electrical efficiency and minimal interference are paramount. The reduction of oxygen content not only improves conductivity but also aids in preventing premature material degradation. Detailed compositional control contributes to predictable mechanical and thermal behaviour, which is essential for integrating materials into advanced electronic systems.

Understanding the metallurgical processes behind oxygen-free copper can benefit material selection in various industrial sectors. Continuous research into refining techniques and quality control standards supports innovation in electronics, heat management, and energy-efficient designs.