CU9680 High-Purity Oxygen-Free Copper Tube Target for LCD Display Sputtering

High-Purity Oxygen-Free Copper Tube Target for LCD Display Sputtering Description

High-Purity Oxygen-Free Copper Tube Target for LCD Display Sputtering is manufactured from refined copper with minimal oxygen content. The tube form ensures a uniform deposition area during sputtering, facilitating even film growth on LCD panels. Its controlled composition minimises potential contamination, while the tube structure supports efficient energy distribution, optimising sputtering yield and coating uniformity in high-precision display applications.

High-Purity Oxygen-Free Copper Tube Target for LCD Display Sputtering Applications

1.       Electronics Manufacturing
- Utilised as a sputtering target in LCD deposition chambers to achieve uniform thin-film coatings by leveraging its oxygen-free composition.
- Employed as a primary element in vacuum deposition systems to control film uniformity by utilising the tube's consistent material structure.

2.       Display Fabrication
- Applied as a coating source in panel production to achieve precise layer thickness control by leveraging its minimal impurity levels.
- Serves as a deposition material in advanced display technologies to enhance uniformity in film growth through its refined copper properties.

3.       Industrial Coating Processes
- Utilised as a sputtering target in industrial-scale coating systems to improve process stability by leveraging its controlled tube form.
- Applied in manufacturing environments requiring consistent film characteristics by utilising its oxygen-free nature.

High-Purity Oxygen-Free Copper Tube Target for LCD Display Sputtering Packing

The target is packaged in anti-static, sealed containers with protective polymer foam inserts to prevent mechanical impact and contamination. Moisture-proof materials and controlled-environment packaging help maintain its oxygen-free status during storage and transit. Custom packaging options, including specialised cushioning and labelling, are available to meet specific shipping and storage requirements for sensitive deposition applications.

Frequently Asked Questions

Q1: How is the oxygen content quantified in the copper tube target?
A1: The oxygen content is quantified using inert gas fusion and X-ray fluorescence analysis. These methods provide accurate measurements, ensuring the copper meets the stringent purity criteria required for consistent sputtering performance.

Q2: What processing techniques are employed to maintain the tube's dimensional accuracy?
A2: The tube is manufactured using precision extrusion and machining, followed by laser scanning for non-destructive dimensional verification. This combination of techniques ensures that the tube maintains strict tolerances, which is crucial for consistent deposition rates.

Q3: How do packaging conditions affect the target's performance during storage?
A3: Packaging that minimises moisture and particulate contamination is critical. Anti-static, moisture-resistant containers paired with controlled temperature conditions help preserve the oxygen-free state of the copper, thereby maintaining optimal performance during the sputtering process.

Additional Information

Copper alloys, particularly oxygen-free variants, are essential in applications that demand low electrical resistance and minimal signal interference. In sputtering targets, controlled oxygen levels play a vital role in preventing unwanted oxidation, which can affect film quality during deposition processes.

Advancements in refining and tube-forming processes have improved the consistency and performance of copper-based targets. Detailed analytical techniques, such as XRF and laser scanning, are routinely employed to verify material properties and dimensional tolerances, ensuring that the products meet the rigorous standards of modern electronic manufacturing.