CU9754 High Oxygen Tough Pitch Copper

High Oxygen Tough Pitch Copper Description

High Oxygen Tough Pitch Copper is a copper-based alloy engineered with precisely regulated oxygen levels to enhance both its electrical and mechanical properties. The material’s composition, predominantly Cu, ensures optimal conductivity and formability in strip applications. The controlled oxygen content aids in reducing grain boundary oxidation, thereby improving ductility during manufacturing processes. This technical specification makes the alloy suitable for applications that demand predictable metallurgical performance and consistent behaviour during deformation.

High Oxygen Tough Pitch Copper Applications

1.       Electronics and Semiconductor Applications
   - Used as a conductive strip in printed circuit assemblies to achieve effective electrical performance by leveraging the lowered oxidation propensity.

2.       Industrial Applications
   - Applied as bus bars in power distribution systems to manage high current loads by utilising enhanced mechanical integrity.
   - Employed in heat exchanger components in industrial ovens to achieve efficient thermal management by leveraging high thermal conductivity.

High Oxygen Tough Pitch Copper Packing

High Oxygen Tough Pitch Copper is packaged using anti-static, moisture-resistant wrapping and sealed cartons with foam inserts to protect against mechanical damage. The packaging often includes nitrogen purging to reduce oxidation risks during transit. Proper storage in cool, dry conditions is recommended to maintain material integrity. Custom packaging options, including specialised labelling and compartmentalisation, are available based on production batch requirements.

Frequently Asked Questions

Q1: How does the controlled oxygen content influence processing?
A1: The controlled oxygen content enhances grain boundary strength while reducing oxidation during heat treatment and forming. This predictable behaviour during processing minimises issues such as embrittlement and ensures consistent physical properties across batches.

Q2: What precautions are recommended for welding or joining this copper alloy?
A2: During welding, preheating may be needed to optimise the fusion zone, and a suitable shielding gas should be used to minimise oxidation at the joint. Adjusting welding parameters based on the alloy's oxygen level can enhance joint quality.

Q3: Can the strip form of this copper be further processed into complex geometries?
A3: Yes, the strip form is designed for additional processing such as bending, stamping, and rolling. Its enhanced ductility and uniform microstructure enable further shaping while reducing the risk of material failure under deformation.

Additional Information

Copper alloys have been extensively studied for their electrical and thermal conductivity along with their mechanical performance. Controlled oxygen levels in tough pitch copper play a significant role in maintaining ductility and reducing stress during forming processes. This makes the material suitable for precision applications in various industrial and research settings.

Understanding the relationship between oxygen content and microstructural properties is key in optimising the performance of copper in demanding environments. Advances in metallurgical processing and inspection techniques have further refined the production of such alloys, ensuring that their properties meet precise engineering requirements for high-performance applications.