CY10351 Potassium Tantalate Niobate KTN Crystal Substrate (100) 5x5x0.5 mm

Potassium Tantalate Niobate KTN Crystal Substrate (100) 5x5x0.5 mm Description

This substrate features a (100) crystallographic orientation with dimensions of 5x5 mm and a thickness of 0.5 mm. The composition, represented as KTa1-XNbXO3, provides defined material properties essential for regulated light modulation and dielectric applications. Its controlled surface finish and flatness support integration into semiconductor processing and photonic device assemblies. The engineering focuses on geometrical accuracy to conform with standard fabrication equipment.

Potassium Tantalate Niobate KTN Crystal Substrate (100) 5x5x0.5 mm Applications

Electronics
- Used as a dielectric interface in integrated circuits to improve signal isolation by leveraging its controlled crystallographic properties.
- Applied as a substrate for thin-film deposition in sensors to achieve stable electrical characteristics through uniform surface morphology.

Optoelectronics
- Employed as a base for designing optical modulators to achieve controlled light propagation by utilising its engineered composition and substrate flatness.
- Used in laser systems as a mounting platform to facilitate efficient beam shaping by ensuring a consistent crystalline structure.

Industrial Systems
- Applied as an insulating layer in power modules to manage thermal and electrical performance by capitalising on its defined material properties.
- Frequently used for microelectronic packaging to minimise contamination risks by offering a smooth and chemically inert surface.

Potassium Tantalate Niobate KTN Crystal Substrate (100) 5x5x0.5 mm Packing

The substrate is individually packaged in anti-static, foam-lined containers to minimise mechanical shock and environmental exposure. Protective polymer films guard against surface contamination, while temperature-controlled storage is recommended to preserve material characteristics. Optional custom packaging is available, including modified cushioning and compartmentalised trays, to meet specific handling requirements during transport and storage.

Frequently Asked Questions

Q1: What environmental conditions are ideal during processing of this substrate?
A1: It is recommended to utilise temperature and humidity-controlled environments during both storage and processing. This approach minimises thermal expansion effects and reduces the risk of contamination affecting the substrate’s surface integrity.

Q2: How is the substrate’s crystallographic orientation verified?
A2: The orientation is evaluated using high-resolution X-ray diffraction and scanning electron microscopy. These measurements ensure alignment within acceptable tolerances for critical device integration.

Q3: What precautions should be considered during handling?
A3: Handling procedures should include the use of anti-static gloves and tools to prevent surface damage and particulate contamination. Adhering to clean room standards is advisable during integration into device assemblies.

Additional Information

In materials science, the controlled development of crystal substrates is pivotal for applications requiring specific dielectric and optical properties. Research in this field emphasises the impact of microscopic surface features and compositional consistency on device performance.
Advancements in characterisation techniques such as X-ray diffraction and electron microscopy have improved understanding of substrate behaviour under operational stress. This broader scientific context supports the integration of ceramic substrates into high-precision industrial systems and electronic assemblies.