CY11152 Copper Coated Glass

Copper Coated Glass Description

Copper Coated Glass is produced through a controlled deposition process wherein a thin copper film is applied to a glass substrate. This process enables accurate control of film thickness and uniformity, vital for electrical performance in semiconductor processes. The material exhibits excellent electrical conduction and mechanical stability, making it suitable for advanced semiconductor raw material applications.

Copper Coated Glass Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Coated Glass Applications

Electronics
- Used as an interconnect seed layer in microelectronic circuits to achieve uniform current transport by leveraging a controlled copper film.
- Applied as a sensor electrode substrate in display systems to enable stable signal conduction by utilising the conductive properties of copper.

Semiconductor Manufacturing
- Employed as a metallisation base in semiconductor devices to ensure firm adhesion of subsequent layers by leveraging accurate film thickness control.
- Used as a foundation for thin-film transistor arrays to enhance charge distribution by capitalising on the substrate's electrical conductivity.

Copper Coated Glass Packing

The Copper Coated Glass is packaged in anti-static, cushioned carriers to shield against mechanical damage and contamination. Each substrate is individually wrapped in an inert film to prevent particle deposition and moisture ingress. Store in a clean, dry environment at controlled room temperature. Custom packaging options, including barrier sealing and temperature regulation, are available to accommodate specific processing needs.

Additional Information

Copper Coated Glass belongs to a class of substrates where metal thin films are deposited onto insulating materials. This technique, widely adopted in semiconductor manufacturing, allows for precise control over electrical and physical properties. The deposition process is critical to achieving the desired film uniformity and adhesion, which ultimately influence device performance.

Understanding the interplay between copper's intrinsic conductivity and glass's insulating properties highlights the relevance of such materials in electronic applications. Advanced deposition methods and rigorous quality control ensure that these substrates meet the stringent requirements of modern semiconductor fabrication environments.