CY11153 Palladium (Pd) Coated Silicon Wafer

Palladium (Pd) Coated Silicon Wafer Description

Palladium (Pd) Coated Silicon Wafer, a silicon substrate featuring an ultra-thin palladium layer, is tailored for semiconductor fabrication. The palladium film functions as an effective barrier against unwanted diffusion and oxidation during high-temperature processing. This metallization enhances interface stability when substantial thermal loads are applied. Its compatibility with standard semiconductor equipment ensures it meets the rigorous demands of advanced microfabrication processes.

Palladium (Pd) Coated Silicon Wafer Characteristics

The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Palladium (Pd) Coated Silicon Wafer Applications

1.       Semiconductor Manufacturing
   - Used as a diffusion barrier in microelectronic device fabrication to mitigate metal migration by leveraging the palladium layer's inert properties.
   - Applied in high-temperature processing systems to preserve substrate integrity and interface uniformity.

2.       Electronics Testing and Research
   - Serves as a substrate for experimental semiconductor structures to study barrier layer performance, utilising the coating to prevent oxidation during thermal cycles.
   - Frequently used in process development laboratories to evaluate interactions between metal coatings and silicon during device scaling.

Palladium (Pd) Coated Silicon Wafer Packing

The wafers are packaged in static-dissipative, anti-scratch trays with a sealed plastic cover to mitigate particulate contamination. Each unit is encased in moisture-resistant, anti-static foil and stored in cleanroom-grade containers. The packaging ensures minimal handling damage while preserving the wafer's surface quality. Custom packaging options and labelling are available to meet specific storage and transportation needs.

Additional Information

Palladium-coated silicon wafers represent a crucial intersection of material science and semiconductor engineering. The integration of a noble metal layer addresses issues related to thermal stability and material interactions during device fabrication. Advanced coatings applied by Stanford Advanced Materials are optimised through rigorous in-line inspection techniques.

In semiconductor research and production, material interfaces play a significant role in the overall performance of electronic devices. Understanding and controlling these interfaces not only improves process yields but also enhances the functional reliability of micro-scale components.