CY9446 Copper Single Crystal Substrates Cu Substrate (100), 5x5x1 mm, SSP

Copper Single Crystal Substrates Cu Substrate (100), 5x5x1 mm, SSP Description

Manufactured with a precise (100) crystallographic orientation, this copper single crystal substrate presents dimensions of 5x5x1 mm. Its uniform crystal structure supports high-resolution applications that rely on minimal grain boundaries and reduced electron scattering. The substrate’s well-controlled thermal history and low defect content enhance its performance in environments where adherence to material integrity is critical. Measurements are verified through advanced diffraction and surface characterisation methods.

Copper Single Crystal Substrates Cu Substrate (100), 5x5x1 mm, SSP Applications

Electronics
- Used as an interconnect medium in microelectronic circuit assemblies to achieve minimized signal interference by leveraging low electron scattering properties.
- Applied as a base for advanced sensor devices to enhance conductivity and structural uniformity, reducing thermal drift.

Industrial
- Used as a heat dissipation component in high-power circuits to manage thermal loads by leveraging uniform crystal alignment.
- Applied as a substrate in precision fabrication processes for high-frequency components to maintain electrical and mechanical stability.

Copper Single Crystal Substrates Cu Substrate (100), 5x5x1 mm, SSP Packing

The substrates are packaged in anti-static, cushioned carriers to prevent mechanical shock and contamination. Each substrate is sealed in a moisture-resistant pouch and stored in a temperature-controlled container. The packaging system includes a desiccant layer to manage humidity. Custom labelling and compartmentalisation options are available to meet specific storage and shipment requirements while safeguarding material integrity.

Frequently Asked Questions

Q1: What impact does the (100) crystallographic orientation have on the substrate’s performance?
A1: The (100) orientation promotes uniform electron transport and minimises boundary scattering. This results in stable conductive properties and enhanced thermal behaviour, which is crucial for high-performance electronic applications.

Q2: How is the defect density controlled during manufacturing?
A2: The production process includes rigorous thermal annealing and x-ray diffraction analysis. These measures help identify and reduce dislocations and inclusions, ensuring the material meets strict performance criteria.

Q3: Can the substrate dimensions be customised for specialised applications?
A3: While the standard dimensions are 5x5x1 mm, SAM offers customisation based on specific technical requirements. Customers are advised to discuss their needs with technical support for potential modifications.

Additional Information

Copper single crystal substrates are essential in precision applications where control over crystallographic orientation directly impacts electronic and thermal performance. These substrates support investigations into crystal growth techniques and enable the development of materials with tailored conductive properties. Advances in fabrication techniques continue to refine the control of grain boundaries and defect densities, providing enhanced performance in a range of high-precision research and industrial applications.

The study of copper crystal substrates also relates to broader aspects of semiconductor device fabrication and materials characterisation. Researchers often explore the correlations between crystallographic orientation and physical properties, contributing to improved methodologies in both experimental design and quality assurance within materials science.