CY9448 Copper Single Crystal Substrates Cu Substrate (100), Dia. 50 mm x 1 mm, SSP

Copper Single Crystal Substrates Cu Substrate (100), Dia. 2 inch x 1 mm, SSP Description

Copper Single Crystal Substrates Cu Substrate (100), Dia. 2 inch x 1 mm, SSP are fabricated from high-purity copper crystal exhibiting a (100) orientation. The 2-inch diameter and 1 mm thickness support integration with standard semiconductor equipment, ensuring a uniform lattice structure with minimal dislocations. The intrinsic single crystal nature reduces electron scattering, beneficial for heat dissipation and electrical performance in high-end electronic assemblies.

Copper Single Crystal Substrates Cu Substrate (100), Dia. 2 inch x 1 mm, SSP Applications

1.       Electronics and Semiconductor Applications
   • Used as a substrate in microelectronic devices to achieve minimised electron scattering by leveraging its uniform crystal orientation.
   • Applied in high-frequency circuit boards to enhance thermal management through improved conductivity.

2.       Industrial Applications
   • Serves as a base layer in precision machining platforms to maintain dimensional stability by utilising its low defect density.
   • Implemented in metallisation processes to support uniform film deposition, thereby improving overall device performance.

Copper Single Crystal Substrates Cu Substrate (100), Dia. 2 inch x 1 mm, SSP Packing

The substrates are packaged in anti-static, foam-lined containers to prevent mechanical damage and contamination. Each unit is sealed in a moisture-resistant pouch and stored at controlled room temperature. The packaging design minimises particulate exposure and electrostatic discharge. Custom packaging options, including compartmentalisation and labelling, are available to suit specific storage and handling protocols.

Frequently Asked Questions

Q1: How does the (100) crystallographic orientation affect substrate performance?
A1: The (100) orientation ensures a uniform lattice structure, reducing dislocation density and improving electrical conductivity. This precision benefits applications requiring consistent electron flow and minimises variability in device performance.

Q2: What specific quality control processes are applied during substrate production?
A2: Stanford Advanced Materials implements surface analysis techniques such as SEM and X-ray diffraction to monitor crystal orientation and detect defects. These rigorous inspections verify the substrate’s flatness and purity, ensuring consistent performance across production batches.

Q3: How does the 2 inch x 1 mm dimensional specification contribute to its integration?
A3: The 2-inch diameter and 1 mm thickness provide compatibility with standard semiconductor equipment. This sizing facilitates uniform processing and integration with existing production lines, reducing equipment adjustments and setup time.

Additional Information

Copper single crystal substrates are essential in applications where minimal grain boundaries and high electrical conductivity are required. Their uniform crystallographic orientation contributes to stable thermal and electrical properties, making them suitable for advanced research and industrial usage. Understanding the interplay between crystal structure and material performance is critical for developing efficient electronic assemblies.

In materials science, high-purity copper substrates also influence the deposition quality of subsequent films. Their use in precise metallisation and heat dissipation systems demonstrates the broader impact of substrate uniformity on device reliability and longevity.