CY9450 Copper Single Crystal Substrates Cu Substrate (110), 5x5x1 mm, SSP

Copper Single Crystal Substrates Cu Substrate (110), 5x5x1 mm, SSP Description

The product is a high-purity copper substrate with a (110) crystallographic orientation and nominal dimensions of 5x5x1 mm. Fabricated using controlled crystal growth and annealing processes, the single crystal structure minimises grain boundary effects. Its defined surface finish and dimensional accuracy support detailed analyses in semiconductor research and materials characterisation. The substrate's uniformity aids in achieving consistent electron scattering and thermal conductivity measurements.

Copper Single Crystal Substrates Cu Substrate (110), 5x5x1 mm, SSP Applications

Electronics Applications
- Used as a conductive layer in microelectronic devices to enhance signal integrity by leveraging its controlled crystallographic orientation.

Research and Development
- Applied as a substrate in surface science studies to investigate copper anisotropy, enabling detailed analysis of electron behaviour with minimal defect interference.

Industrial Processing
- Frequently used in calibration systems for quality control to validate measurement equipment by utilising its precise dimensions and crystalline uniformity.

Copper Single Crystal Substrates Cu Substrate (110), 5x5x1 mm, SSP Packing

Each substrate is individually secured within an antistatic, foam-lined carrier and sealed in a moisture-resistant bag to limit oxidation and contamination. The packing method includes a secondary protective layer and clear labelling for identification. Storage in a temperature-controlled and clean environment is recommended. Customised packaging options are available to suit specific handling or transport requirements.

Frequently Asked Questions

Q1: What control measures ensure the crystal orientation accuracy?
A1: The production process includes X-ray diffraction and optical microscopy inspections that verify the (110) orientation with atomic-scale tolerance, ensuring minimal deviation from desired crystallographic parameters.

Q2: How is the substrate surface quality maintained during fabrication?
A2: Sequential polishing, cleaning procedures, and atomic force microscopy are employed during manufacturing to achieve low surface roughness, which is critical for applications requiring precise electron behaviour assessments.

Q3: Can these substrates support high-temperature processes?
A3: The substrates have been tested under elevated temperature conditions typical of semiconductor processing. Thermal cycling and metallurgical evaluations confirm that the material retains its microstructural integrity without undergoing phase changes.

Additional Information

Copper single crystals provide a distinct advantage for studies of anisotropic electrical conduction and material defect analysis. Their uncluttered grain structure allows for precise investigation of electron dynamics and surface interactions, which is crucial in both academic research and industrial material development.

Advances in crystal growth technology have improved the reproducibility and purity of copper substrates. Enhanced fabrication processes result in substrates with a controlled crystallographic orientation, boosting the accuracy of measurements in electron microscopy, spectroscopy, and thermal conductivity evaluations.