CY9452 Copper Single Crystal Substrates Cu Substrate (110), 10x10x1 mm, SSP

Copper Single Crystal Substrates Cu Substrate (110), 10x10x1 mm, SSP Description

This monocrystalline copper substrate exhibits a (110) crystallographic orientation and precise dimensions of 10x10x1 mm. Its single crystal nature minimises electron scattering and reduces surface discontinuities, making it suitable for semiconductor processes and electronic device applications. The engineered microstructure is verified through X-ray diffraction and electron microscopy, ensuring controlled grain boundary absence and uniform surface topography.

Copper Single Crystal Substrates Cu Substrate (110), 10x10x1 mm, SSP Applications

1.       Electronics
   - Used as an interconnect base in high-frequency circuits to achieve reduced electron scattering by leveraging its single crystal structure.
   - Applied as a substrate in micro-electronic packaging to improve signal clarity by utilising its uniform surface morphology.

2.       Industrial
   - Frequently used as a test platform in process development for semiconductor fabrication to optimise deposition processes by exploiting its consistent crystallographic orientation.
   - Serves as a calibration standard in material characterisation setups by offering controlled surface properties.

Copper Single Crystal Substrates Cu Substrate (110), 10x10x1 mm, SSP Packing

The substrates are secured in anti-static foam-lined carriers to minimise handling impacts and surface contamination. They are sealed in moisture-barrier packaging designed to maintain a dry, ambient environment and prevent particulate exposure. Temperature control is recommended during storage to preserve the crystallographic integrity. Custom labelling and compartmental layouts are available to suit specific logistics and traceability requirements.

Frequently Asked Questions

Q1: How is the (110) orientation verified in these substrates?
A1: The (110) orientation is confirmed using X-ray diffraction techniques coupled with electron microscopy analysis. These assessments ensure the crystal lattice alignment meets stringent specifications required for semiconductor device testing.

Q2: What measures are taken to minimise surface contamination during production?
A2: The manufacturing process incorporates clean room environments and meticulous handling procedures, including anti-static protocols and controlled atmosphere processing, to limit particulate and moisture contamination on the substrate surface.

Q3: Can these substrates be integrated into existing semiconductor processing equipment?
A3: Yes, the substrate dimensions of 10x10x1 mm are compatible with standard semiconductor processing platforms, allowing for straightforward integration and process adaptation without extensive retooling.

Additional Information

Copper single crystal substrates provide a platform for research and industrial applications where minimal grain boundaries are critical. The monocrystalline structure enhances electron transport and reduces scattering, which is vital for processes requiring high data integrity and signal stability. These substrates find broad utility in electronics, where refined material properties significantly impact device performance.

Understanding the behaviour of copper in single crystal forms also contributes to advancements in microelectronic interconnects and sensor technologies. Researchers benefit from detailed surface characterisation techniques and rigorous process controls, all of which inform material innovation and process optimisation in semiconductor fabrication.