CY9454 Copper Single Crystal Substrates Cu Substrate (111), Dia. 10 mm x 1 mm, SSP

Copper Single Crystal Substrates Cu Substrate (111), Dia. 10 mm x 1 mm, SSP Description

Copper Single Crystal Substrates Cu Substrate (111), Dia. 10 mm x 1 mm, SSP is engineered through a controlled growth process to yield a consistent (111) crystallographic orientation. The 10 mm diameter and 1 mm thickness ensure compatibility with standard semiconductor processing tools. Its single crystal structure minimises grain boundaries, thereby reducing scattering effects and enhancing electrical properties. Detailed surface and structure evaluations verify the substrate’s uniformity, making it suitable for precise electronic and microfabrication applications.

Copper Single Crystal Substrates Cu Substrate (111), Dia. 10 mm x 1 mm, SSP Applications

1.       Electronics
   - • Used as a grounding plane in RF circuits to achieve improved signal clarity by leveraging its minimal grain boundary interference.
   - • Applied as a heat spreader in LED assemblies to manage thermal loads by leveraging its high thermal conductivity.

2.       Industrial
   - • Used as a component in sensor devices to reduce electrical noise by leveraging its uniform crystalline structure.
   - • Applied in microfabrication processes to achieve smoother etching surfaces by leveraging its defect-minimised, single crystal configuration.

3.       Scientific Research
   - • Used as a reference substrate in crystallographic studies to achieve accurate lattice parameter measurements by leveraging its well-defined (111) orientation.
   - • Applied in materials science experiments to analyse grain boundary phenomena by leveraging its consistent single crystal properties.

Copper Single Crystal Substrates Cu Substrate (111), Dia. 10 mm x 1 mm, SSP Packing

The substrates are packaged in anti-static carriers and cushioned foam-lined containers to protect the single crystal surface from mechanical damage and contamination. They are stored in a dry, temperature-controlled environment to minimise oxidation risk. Custom labeling and compartmentalisation options are available, ensuring proper handling and storage conditions for sensitive processing environments.

Frequently Asked Questions

Q1: How does the (111) crystallographic orientation benefit electronic applications?
A1: The distinct (111) orientation minimises grain boundaries, which helps reduce electron scattering and enhances thermal conductivity. This property is essential for improving performance in high-frequency and microelectronic circuits.

Q2: What quality control measures are employed during production?
A2: The substrates undergo x‑ray diffraction and electron microscopy analysis to verify the (111) orientation and ensure dimensional consistency. These inspections help identify microstructural anomalies and maintain strict tolerances required for semiconductor processing.

Q3: Are customisation options available for the substrate dimensions?
A3: Yes, customisation of diameter and thickness is possible. Adjustments are made while maintaining crystallographic consistency through monitored processing protocols. Coordination with the technical team is required to confirm feasibility and any necessary process modifications.

Additional Information

Copper single crystal substrates hold significance in advanced material studies, particularly for applications demanding minimal defect densities and high electrical performance. Their controlled crystal growth processes provide insights into grain boundary behaviour and facilitate research into material defect mitigation.

In broader materials science, single crystal copper substrates contribute to the development of semiconductor devices by enabling consistent microstructural properties. They serve as a baseline for understanding crystallographic effects on electrical and thermal performance, thus supporting innovations in microfabrication and electronic materials.