CY9457 Copper Single Crystal Substrates Cu Substrate (111), 10x10x0.5 mm, SSP

Copper Single Crystal Substrates Cu Substrate (111), 10x10x0.5 mm, SSP Description

The product is fabricated from high-purity copper with a (111) crystallographic orientation, ensuring a uniform lattice structure throughout the 10x10 mm surface. The substrate measures 0.5 mm in thickness, optimised for semiconductor and materials science research. The controlled crystalline properties reduce grain boundary variability, assisting in analytical and deposition applications. Employing stringent surface characterisation methods, Stanford Advanced Materials (SAM) confirms the flatness and homogeneity essential for sensitive process integrations.

Copper Single Crystal Substrates Cu Substrate (111), 10x10x0.5 mm, SSP Applications

1.       Electronics
   - Used as a base for epitaxial growth in semiconductor devices to minimise lattice mismatches by leveraging the uniform (111) orientation.
   - Applied as a substrate in microelectronic interconnect testing to achieve stable conductivity through controlled crystal structure.

2.       Materials Science Research
   - Serves as a sample holder in thin-film deposition systems to secure a consistent crystallography that enhances film adhesion.
   - Frequently used in surface analysis studies to assess the impact of atomic arrangement on material properties by exploiting its homogeneous structure.

Copper Single Crystal Substrates Cu Substrate (111), 10x10x0.5 mm, SSP Packing

The substrates are packaged in antistatic, moisture-barrier pouches with foam inserts to inhibit mechanical shocks and environmental contamination. Storage instructions recommend a dry, temperature-controlled environment. Additional protective layers and customised compartmentalised packaging are available based on user requirements to safeguard the substrate during shipment and long-term storage.

Frequently Asked Questions

Q1: How does the (111) orientation impact the performance of the copper substrate?
A1: The (111) orientation produces a consistent atomic arrangement, which minimises defects during thin-film deposition, thereby supporting uniform layer growth and improved electronic performance in processing equipment.

Q2: What quality control measures are applied during production?
A2: SAM employs direct microscopic surface inspection and X-ray diffraction analysis to verify crystal orientation and structural consistency. This methodology ensures each substrate meets the specified (111) alignment and surface flatness criteria.

Q3: Can this substrate be integrated into existing semiconductor processing workflows?
A3: Yes, its 10x10 mm size and 0.5 mm thickness conform to equipment standards commonly found in semiconductor fabrication. The consistent crystal quality simplifies integration into routine deposition and etching processes.

Additional Information

The single crystal nature of copper substrates plays a significant role in reducing defects at the atomic level, thereby supporting advanced semiconductor fabrication. Uniform crystal orientation, such as (111), provides a reliable platform for studying interfacial phenomena and thin-film growth.

In the broader context of materials science, single crystal substrates are essential for research that requires precise control over structural properties. These substrates facilitate the understanding of fundamental crystallographic effects on material performance, aiding both academic and industrial investigations into advanced electronic and optical applications.