CY9463 Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 0.5 mm, SSP

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 0.5 mm, SSP Description

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 0.5 mm, SSP is manufactured from high-purity polycrystalline nickel. The substrate’s dimensions (10 x 10 mm with a 0.5 mm thickness) facilitate compatibility with standard processing equipment. Its uniform microstructure minimises inconsistencies across grain boundaries, benefiting thin film deposition and microfabrication. This controlled substrate aids in achieving repeatable results in semiconductor device assembly and photovoltaic research.

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 0.5 mm, SSP Applications

1.       Electronics
   - Used as a deposition substrate in semiconductor devices to achieve uniform thin film formation by leveraging controlled microstructure.
   - Applied as a base layer for integrated circuits to support precise patterning and high-resolution etching due to its consistent dimensional tolerance.

2.       Photovoltaics
   - Serves as a support substrate in solar cell assembly to achieve efficient charge collection by leveraging its uniform grain structure.

3.       Research and Industrial Testing
   - Used as a standard material in materials research to evaluate nickel-based film deposition processes by leveraging its controlled surface finish.

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 0.5 mm, SSP Packing

Each substrate is individually packaged in a static-free, anti-scratch pouch and placed in a cushioned container to mitigate mechanical stress during handling. Storage conditions require a dry, temperature-stable environment to prevent oxidation and preserve microstructural integrity. Custom packaging options, including batch labelling and anti-contamination inserts, are available to meet specific laboratory or manufacturing requirements.

Frequently Asked Questions

Q1: How does the polycrystalline structure affect thin film deposition?
A1: The uniform polycrystalline structure minimises variations during thin film growth, promoting consistent layer adhesion and enhanced device reproducibility in semiconductor applications.

Q2: What quality control measures verify the substrate’s dimensional tolerances?
A2: The substrate undergoes electron microscopy inspection and precise metrology to assess grain uniformity and dimensional accuracy, ensuring suitability for high-precision processing environments.

Q3: Is customisation of substrate thickness available?
A3: Yes, while the standard thickness is 0.5 mm, custom orders can adjust substrate thickness according to experimental needs, with equivalent quality assurance protocols maintained in production.

Additional Information

Polycrystalline nickel substrates are fundamental in the fabrication of electronic devices, where controlled microstructure plays a critical role in the performance of deposited films. The material properties of nickel, including its corrosion resistance and stable electrical behaviour, contribute to its widespread use in semiconductor research and industrial applications.

Advancements in metallurgical processing have enabled precise control over the grain structure of these substrates. This, in turn, facilitates improved reproducibility in experimental outcomes and supports the development of innovative thin film deposition techniques, which are pivotal in both academic research and industrial manufacturing environments.