CY9464 Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 1 mm, SSP

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 1 mm, SSP Description

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 1 mm, SSP consists of a polycrystalline nickel structure measured at 10 mm by 10 mm with a thickness of 1 mm. Its uniform grain distribution supports applications requiring consistent thermal and electrical properties. The defined dimensions facilitate compatibility with standard semiconductor and materials research apparatus. SAM’s process control, including thermal profiling and surface evaluation, ensures the substrate meets stringent material standards.

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 1 mm, SSP Applications

1.       Electronics and Semiconductor Processing
   - Used as a base for thin-film deposition in semiconductor devices to achieve uniform layer formation by leveraging controlled grain structure.
   - Applied as a substrate for sensor fabrication to enable consistent electrical characteristics through its stable thermal conductivity.

2.       Industrial and Research Instrumentation
   - Serves as a support in precision metrology systems to achieve accurate measurement outcomes by utilising its consistent surface properties.
   - Frequently employed in experimental setups for material stress tests to observe performance under controlled thermal variations.

Nickel Polycrystalline Substrate Ni Substrate 10 x 10 x 1 mm, SSP Packing

The substrates are individually secured in anti-static, cushioned containers to minimise mechanical impact and contamination during transit. They are enclosed in moisture-barrier packaging and stored in a controlled temperature environment to prevent oxidation. Custom packaging options, including lab-specific compartmentalisation and labelling, are available for ensuring proper handling and storage in sensitive research settings.

Frequently Asked Questions

Q1: How does the polycrystalline structure affect the substrate’s performance?
A1: The polycrystalline structure offers a defined grain distribution that is critical for uniform thermal and electrical properties. This structure helps ensure consistency during thin-film deposition and material testing, resulting in predictable performance in semiconductor and research applications.

Q2: What processing assessments are performed on this substrate?
A2: SAM employs metallurgical techniques such as electron microscopy and surface profilometry to evaluate the grain boundaries and surface flatness. These assessments confirm the substrate’s structural uniformity, which is essential for subsequent material layer applications.

Q3: Are there specific storage conditions recommended for this substrate?
A3: Yes, it is recommended to store the substrate in a low-humidity, temperature-controlled environment with anti-static packaging. This precaution minimises oxidation risks and maintains the integrity of the polycrystalline structure during long-term storage.

Additional Information

Polycrystalline substrates are widely utilised in materials science for their stable microstructural properties. Nickel, with its high thermal conductivity and chemical inertness, serves as an effective material for substrates used in diverse processing environments. Detailed analysis of grain boundaries supports optimal performance in semiconductor processing and research applications.

These substrates frequently undergo thermal and mechanical evaluations to ensure consistent performance under operational conditions. Understanding the relationship between microstructure and macroscopic properties is essential for advancing applications in electronics and industrial material science.