OP10335 Diamond on Silicon Wafer (DOS) 5x5 mm

Diamond on Silicon Wafer (DOS) 5x5 mm Description

Diamond on Silicon Wafer (DOS) 5x5 mm is constructed using a carbon (C) and silicon (Si) composite that incorporates a diamond-like surface structure. The 5 mm x 5 mm dimensions ensure compatibility with standard semiconductor and optical metrology systems. The unique surface morphology enhances reflectivity and thermal dissipation while offering an inert interface for minimised contamination. These characteristics are beneficial for precision optical applications and semiconductor process evaluation.

Diamond on Silicon Wafer (DOS) 5x5 mm Applications

Electronics
- Used as a calibration wafer in optical sensor assembly to reduce signal distortions by leveraging the diamond-coated surface.
- Applied as a substrate in photonic device fabrication to improve signal clarity with its controlled microstructure.

Healthcare
- Used as a reflective element in diagnostic imaging systems to enhance measurement precision by exploiting uniform optical properties.
- Employed in bio-sensing devices to maintain calibration accuracy through a stable thermal profile and surface composition.

Industrial
- Frequently used as a reference standard in optical metrology systems to achieve measurement consistency by using its homogeneous material structure.
- Applied as a test wafer in semiconductor process validation to detect process deviations through its engineered surface finish.

Diamond on Silicon Wafer (DOS) 5x5 mm Packing

The wafer is individually packaged in an anti-static, foam-lined container to reduce mechanical shock and airborne particle contamination. Each unit is sealed within a moisture-barrier pouch and stored at room temperature in a clean, dust-free environment. Additional customisation options, such as labelled compartments and secondary protective layers, are available upon request to meet specific handling and storage protocols.

Frequently Asked Questions

Q1: What are the primary optical benefits of the diamond-coated surface?
A1: The diamond-like structure enhances light modulation and reflection while improving thermal dissipation. This benefits optical inspection systems by providing a stable, repeatable reflective profile.

Q2: How does the composite nature of carbon and silicon affect process integration?
A2: The combination of carbon and silicon offers a balance between hardness and thermal conductivity, ensuring compatibility with semiconductor processes while minimising surface contamination risk.

Q3: What handling precautions are recommended during wafer processing?
A3: It is advised to use clean-room protocols and anti-static tools during handling. Avoid mechanical shocks and exposure to humidity, as these may affect the surface integrity and measurement accuracy.

Additional Information

Materials science in optical applications often demands a high degree of surface uniformity and controlled microstructural properties. The integration of diamond-like carbon with silicon substrates exemplifies how engineered composites can address stringent requirements for reflectivity and thermal management. Understanding the interplay between compositional elements and processing techniques is essential in optimising performance in advanced optical systems.

Moreover, ongoing research in surface treatment and thin-film deposition techniques continues to refine the properties of such composite wafers. These advancements contribute to evolving standards in metrology, semiconductor processing, and high-precision optical assemblies, offering a broader context for applications in both commercial and scientific settings.