OP10336 Diamond on Oxide Wafer (DOI) 5 mmx5 mmx 2 um

Diamond on Oxide Wafer (DOI) 5 mmx5 mmx 2 um Description

Diamond on Oxide Wafer (DOI) 5 mmx5 mmx 2 um consists of a diamond layer deposited on an oxide substrate combining carbon and silicon elements. The 5 mm x 5 mm dimension ensures compatibility with standard laboratory testing fixtures, while the 2 µm thickness provides detailed resolution for optical experiments. The material properties are characterised by high thermal conductivity and chemical inertness, supporting its use as a benchmarking component in optical device fabrication.

Diamond on Oxide Wafer (DOI) 5 mmx5 mmx 2 um Applications

1.      
Optical Device Testing
   - Used as a calibration plate in spectroscopic systems to achieve accurate baseline measurements by leveraging its uniform diamond film.
   - Applied as an alignment aid in photolithography to improve overlay accuracy while utilising its consistent oxide interface.

2.      
Microelectronic Component Fabrication
   - Serves as a substrate for integrating micro-scale sensors in semiconductor devices to enhance signal fidelity through controlled diamond deposition.
   - Frequently used in research settings for pattern transfer studies to achieve precise etching profiles with its stable composite structure.

Diamond on Oxide Wafer (DOI) 5 mmx5 mmx 2 um Packing

The wafer is packaged in an anti-static, low-humidity sealed container with acid-resistant foam supports to prevent mechanical deformation and contamination. Storage should occur in a temperature-controlled environment to avoid thermal fluctuations. Additional customisation for compartmentalised packaging and detailed labelling is available upon request, ensuring the product remains protected during transit and storage.

Frequently Asked Questions

Q1: How does the diamond film integrity affect optical performance?
A1: The uniformity of the diamond film directly influences light transmission and scattering properties. A consistent film ensures repeatable optical responses, critical for calibration and precision alignment in optical systems.

Q2: What precautions are recommended during wafer handling?
A2: Due to its 2 µm thickness, minimal contact forces are required during handling. Utilise anti-static gloves and clean-room procedures to prevent particulate contamination or mechanical stress that could disrupt the film's uniformity.

Q3: Can this wafer be integrated with standard microfabrication techniques?
A3: Yes, the dimension and material composition of the wafer allow compatibility with standard photolithography and etching processes. Its oxide layer supports efficient adhesion and pattern transfer, facilitating integration into existing research and production workflows.

Additional Information

Diamond on Oxide Wafer products represent a convergence of advanced deposition techniques and precise material characterisation. The process combines controlled chemical vapour deposition with real-time monitoring to achieve film uniformity at the micron scale. Such precision is critical in developing components for optical testing and microelectronic applications.

In materials science, hybrid wafers like the diamond on oxide variant offer controlled interfaces that are essential in modern micro-device engineering. The interplay between diamond's thermal properties and the oxide layer's insulating attributes provides a foundation for research into high-performance optical and electronic systems.