SC9874 Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate Description

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate integrates silicon nitride and silicon carbide to form a ceramic composite with a bonded microstructure. The plate supports effective thermal management with a thermal conductivity of 15 W/(m·k) and maintains structural integrity when operated at temperatures up to 1 450 ℃. Its customisable dimensions allow precise adaptation to system layouts, while the density standard of ≥2.7 g/cm³ contributes to its mechanical stability and durability.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate Applications

1.       Industrial Applications
- Used as a heat spreader in furnace systems to achieve uniform temperature distribution by leveraging its thermal conductivity and high operating temperature.
- Applied as a structural support component in high-temperature processing equipment to control thermal gradients and reduce thermal stress.

2.       Electronics Applications
- Employed as a substrate for power electronics to manage heat dissipation by leveraging its ceramic composition and tailored dimensions.
- Utilised in sensor housings to ensure stable performance under elevated temperatures by taking advantage of its consistent density and thermal properties.

3.       Automotive Applications
- Used as a wear-resistant component in braking systems to achieve predictable mechanical behaviour by leveraging its bonded ceramic structure.
- Applied in engine components to enhance heat management, ensuring dimensional stability and controlled thermal expansion.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate Packing

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate is packaged in a cushioned, anti-static container with foam inserts to prevent mechanical damage. The plate is sealed in moisture-resistant wrapping and placed in a rigid box to avoid contamination during transport and storage. Storage recommendations include a stable, dry environment, and packaging can be customised to include additional protective layering upon request.

Frequently Asked Questions

Q1: How does the bonded structure affect the plate’s thermal performance?
A1: The bonded microstructure enhances thermal transfer by combining silicon nitride and silicon carbide, leading to efficient heat distribution and reduced thermal gradients in practical applications.

Q2: What are the benefits of customised dimensions for this plate?
A2: Custom dimensions allow precise integration into specific equipment or systems, ensuring compatibility with existing configurations and facilitating targeted thermal management without excessive material waste.

Q3: What quality control measures does SAM employ for this product?
A3: SAM implements SEM inspection and rigorous sintering process controls to monitor phase uniformity and microstructure integrity, which minimises defects and ensures the product meets technical standards.

Additional Information

Ceramic composites like Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate play an essential role in managing thermal and mechanical loads in various industrial systems. The combination of silicon nitride and silicon carbide ensures that the material exhibits balanced thermal conductivity and mechanical resilience, making it suitable for high-temperature applications.

Advanced processing techniques, such as controlled sintering and meticulous powder blending, help refine the microstructure of these ceramics. Understanding these factors is essential for engineers and researchers who seek to optimise performance in environments where temperature fluctuations and mechanical stresses are significant.