SC9875 Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 10 mm thick

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 10 mm thick Description

The Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 10 mm thick is a ceramic composite that integrates silicon nitride and silicon carbide in a bonded configuration. The plate’s 10 mm thickness, density of ≥2.7 g/cm³, thermal conductivity of 15 W/(m·k), and ability to operate up to 1 450 ℃ make it suitable for applications where thermal management and dimensional stability are critical. Its engineered microstructure supports consistent performance under demanding conditions.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 10 mm thick Applications

1.       Industrial Applications
   - Used as a thermal barrier in high-temperature processing equipment to achieve uniform heat distribution by leveraging its controlled thermal conductivity.

2.       Electronics Applications
   - Applied as a substrate in power electronics modules to achieve stable thermal management by leveraging its high density and precise dimensional accuracy.

3.       Automotive Applications
   - Serves as a structural element in engine components to achieve minimal thermal expansion by leveraging its bonded SiN-SiC composite structure.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 10 mm thick Packing

The plates are packaged in anti-static, moisture-resistant pouches and secured within foam-lined containers to minimise mechanical stress during transit. The packaging incorporates anti-contamination measures, and products are stored in a cool, dry environment to maintain material integrity. Customers may request customised packaging options including compartmentalised crates and specific labelling to suit unique logistical requirements.

Frequently Asked Questions

Q1: How does the bonding process impact thermal performance?
A1: The bonding process ensures a uniform distribution of silicon nitride on the silicon carbide substrate. This uniformity contributes to controlled thermal conductivity and minimises localised thermal gradients. SEM inspections and thermal cycling tests are performed to validate the consistency and reliability of the thermal performance under operational stresses.

Q2: What measures are taken to verify the density of the plate?
A2: Density verification is achieved using calibrated methods, such as the Archimedes principle, to confirm that each plate meets or exceeds the density specification of ≥2.7 g/cm³. This process ensures the material’s mechanical strength and supports its expected thermal performance across production batches.

Q3: How are operating temperature limits confirmed for this product?
A3: Operating temperature limits are confirmed through controlled thermal testing that simulates prolonged exposure conditions. These tests validate that the material maintains structural integrity and dimensional stability at temperatures up to ≤1 450 ℃, ensuring suitability for high-temperature applications.

Additional Information

Silicon nitride and silicon carbide are advanced ceramics known for their mechanical strength and thermal stability. Combining these materials yields a composite that benefits from the high-temperature resilience of SiC and the refined microstructure of SiN. This integration is central to applications where precise thermal management and durability are essential.

Advanced ceramic composites like this plate are subject to extensive quality control and microstructural analysis. These processes help ensure that the material consistently meets stringent industrial standards, supporting its use in environments where performance under high thermal loads and mechanical stress is critical.