SC9876 Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 15 mm thick

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 15 mm thick Description

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 15 mm thick incorporates a composite structure of silicon nitride and silicon carbide that ensures uniform mechanical performance. The 15 mm thickness provides predictable stress distribution, while its thermal conductivity of 15 W/(m·k) and temperature tolerance up to 1 450℃ enable its use in industrial environments requiring efficient heat management. Controlled sintering protocols maintain the ceramic's microstructural integrity for precise performance under load.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 15 mm thick Applications

Industrial
- Used as a structural component in high-temperature processing equipment to achieve uniform heat distribution by leveraging its controlled thermal conductivity.
- Applied as a heat spreader in furnace systems to manage temperature gradients through its consistent 15 mm thickness.

Electronics
- Employed as a substrate in semiconductor processing to maintain dimensional stability under thermal cycling by utilising its composite ceramic structure.

Automotive
- Used as a heat barrier in exhaust system assemblies to moderate thermal flux by taking advantage of its high operating temperature resistance.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 15 mm thick Packing

The product is packaged in anti-static, moisture-resistant wrapping and secured in custom-moulded foam-lined containers to prevent physical damage and contamination. Packaging includes protective films and sealing measures to maintain dryness during transit and storage. Options for customised labelling and compartmentalisation are available. Storage should occur in a dry, temperature-controlled environment to prevent moisture absorption and degradation.

Frequently Asked Questions

Q1: How does the composite structure affect the thermal performance of the plate?
A1: The integration of silicon nitride and silicon carbide results in a balanced thermal conductivity profile. Controlled sintering yields a uniform microstructure, minimising thermal hotspots and ensuring predictable performance under cyclic high-temperature conditions.

Q2: What role does the 15 mm thickness play in the plate's structural integrity?
A2: The consistent 15 mm thickness aids in even stress distribution across the material, reducing localized deformation under mechanical load. Dimensional inspections and microstructural analyses further validate the plate’s capability to bear operational stresses.

Q3: What storage conditions are required to maintain the product's performance?
A3: The plate should be stored in a dry, temperature-controlled environment to avoid moisture uptake. Protective packaging and anti-contamination measures prevent physical damage, thereby preserving its structural and thermal properties over time.

Additional Information

Ceramic composites combining silicon nitride and silicon carbide offer distinct advantages in high-temperature environments. The sintering process is optimised to minimise defects and control grain structure, leading to improved thermal management and mechanical stability. Advanced characterisation techniques are routinely applied to verify material consistency and performance tolerances.

Understanding the behaviour of composite ceramics under thermal and mechanical stress is essential for engineering solutions in industrial applications. Ongoing research focuses on refining sintering protocols and microstructural control to enhance durability and efficiency, thus supporting innovation in thermal management systems and structural components across various industries.