SC9877 Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 20 mm thick

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 20 mm thick Description

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 20 mm thick combines silicon nitride (SiN) and silicon carbide (SiC) in a composite structure, offering a 20 mm thickness that supports dimensional stability. Its 15 W/(m·k) thermal conductivity aids in heat dissipation during high-temperature processing. The composite’s design minimises thermal stress and chemical exposure, making it suitable for applications that demand material endurance under rigorous industrial conditions.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 20 mm thick Applications

Industrial Applications
- Use as a structural component in high-temperature processing equipment to achieve thermal stability by leveraging its 20 mm thickness and controlled heat transfer properties.
- Use as a protective barrier in chemical processing systems to achieve resistance to thermal and chemical stresses by leveraging its composite material properties.

Electronics Applications
- Use as a substrate in thermal management systems for power electronics to achieve regulated device temperature by leveraging its thermal conductivity of 15 W/(m·k).
- Use as an insulating platform in sensor housings to achieve consistent performance at elevated temperatures by leveraging its stable composite structure and material density.

Silicon Nitride Bonded Silicon Carbide Plate SNBC Plate 20 mm thick Packing

The plate is secured in foam-lined, anti-static containers and wrapped in protective films to minimise contamination and physical damage during transport. Storage requires a dry, temperature-controlled environment to preserve material integrity. Additional customisation options include vacuum sealing and labelled, compartmentalised packaging based on specific customer requirements. These measures are implemented to safeguard the material throughout storage and transit.

Frequently Asked Questions

Q1: What is the significance of the 20 mm thickness in thermal applications?
A1: The 20 mm thickness offers enhanced dimensional stability and effective heat distribution. This feature helps in maintaining consistent thermal profiles during high-temperature processes, thereby reducing the risk of localised overheating and ensuring balanced stress distribution.

Q2: How does the composite structure of SiN and SiC influence performance under thermal stress?
A2: The integration of SiN and SiC in a composite structure combines the high thermal conductivity of SiC with the thermal shock resistance of SiN. This balance mitigates rapid thermal gradients and minimises micro-cracking, contributing to overall performance stability in harsh environments.

Q3: What storage conditions are recommended for this ceramic plate?
A3: It is advisable to store the ceramic plate in a dry, temperature-controlled environment to prevent moisture absorption and thermal degradation. Anti-static and cushioned packaging further help to reduce mechanical impacts and preserve material integrity during long-term storage.

Additional Information

Ceramic composites like the Silicon Nitride Bonded Silicon Carbide Plate are extensively used in industrial applications where thermal shock resistance and mechanical stability are critical. The integration of SiN and SiC offers a unique combination of properties that cater to both high-temperature performance and chemical resistance.

Understanding the behaviour of ceramic composites under varying thermal loads is essential for material selection in process industries. Advancements in sintering techniques and microstructural control continue to enhance the performance of these materials, supporting precision applications in electronics, manufacturing, and chemical processing.