SC9882 Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 30 x 30 mm

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 30 x 30 mm Description

The Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 30 x 30 mm is fabricated from a composite of silicon nitride (SiN) and silicon carbide (SiC), offering a design optimised for thermal and mechanical stability. The 30 x 30 mm dimension aligns with standardised setups in high-temperature environments. The specified thermal conductivity of 15 W/(m·k) and an operating temperature limit of 1450 ℃ underscore its suitability in applications where maintained heat transfer and structural retention are critical.

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 30 x 30 mm Applications

Industrial Processing
- Used as a structural component in high-temperature furnaces to achieve consistent heat distribution by leveraging the ceramic’s thermal conductivity.
- Applied as a support beam in processing equipment to maintain structural integrity under prolonged thermal stress.

Precision Instrumentation
- Employed as a stable platform in measurement devices requiring minimal thermal expansion, ensuring accurate performance in temperature-sensitive environments.
- Serves as a fixture in calibration systems where dimensional uniformity under heat ensures precise instrument alignment.

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 30 x 30 mm Packing

The beam is packaged in custom-moulded foam inserts within sealed, anti-static containers to minimise mechanical impact and airborne contamination. Storage instructions recommend keeping the packaging in a dry, clean, and temperature-controlled environment. Additional protective layers are available upon request to conform to specific handling needs during transportation and storage, ensuring minimal exposure to environmental contaminants.

Frequently Asked Questions

Q1: What testing methods are used to verify the microstructural consistency of the beam?
A1: SAM uses scanning electron microscopy (SEM) and X-ray diffraction (XRD) to verify microstructural consistency and ensure that the bonded phases meet the required tolerances for high-temperature performance.

Q2: How does the thermal conductivity of 15 W/(m·k) benefit high-temperature applications?
A2: The thermal conductivity value facilitates effective heat transfer, reducing thermal gradients and potential hotspots in processing environments, which helps maintain dimensional stability under heat.

Q3: Are there any special handling requirements during installation?
A3: The beam should be handled using clean tools and stored in a controlled environment. Avoid impact and abrupt temperature changes to maintain the integrity of the ceramic structure during installation.

Additional Information

Ceramic materials like the silicon nitride and silicon carbide composite are valued in high-temperature and mechanical stress applications due to their inherent stability and thermal management capabilities. The intrinsic properties of these materials, including low thermal expansion and high modulus, make them a common choice in environments requiring sustained structural performance under cyclical heating and cooling.

Advancements in ceramic processing techniques continue to improve the bonding properties of multiphase composites. These improvements expand their use in precision engineering applications by ensuring dimensional accuracy and consistency in operational performance, which is critical in industrial processing and precision measurement systems.