SC9888 Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 50 x 60 mm

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 50 x 60 mm Description

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 50 x 60 mm consists of a silicon nitride matrix bonded with silicon carbide particles. The defined 50 x 60 mm dimensions facilitate straightforward integration into structural assemblies requiring minimal thermal distortion. The thermal conductivity of 15 W/(m·k) aids in managing heat distribution, while the operating temperature threshold of ≤1450 ℃ confirms its application in high-temperature conditions. The minimum density of ≥2.7 g/cm³ further supports mechanical stability under load.

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 50 x 60 mm Applications

Industrial Applications
- Utilised as a structural support in high-temperature furnaces to achieve stable load-bearing performance by leveraging its engineered composite structure.
- Applied as a thermal management component in heat exchangers to facilitate efficient heat dispersion by harnessing its specified thermal conductivity.

Semiconductor Processing
- Used as a support structure in processing furnaces to maintain dimensional stability under repeated thermal cycling by exploiting its composite bonding properties.

Silicon Nitride Bonded Silicon Carbide Beam SNBC Beam 50 x 60 mm Packing

The beam is securely packaged in anti-static, shock-absorbing containers with foam inserts. Each unit is wrapped in moisture-resistant material to protect against environmental contaminants and mechanical disturbances during transport. Storage is recommended in a climate-controlled environment to prevent thermal or humidity stress. Customised packaging solutions, including individual labelling and compartmentalisation, are available upon request.

Frequently Asked Questions

Q1: What measures ensure the dimensional stability of the SNBC Beam under thermal cycling?
A1: The composite beam undergoes thermal shock evaluation and optical dimensional inspections. These tests verify that the beam maintains tolerances even after repeated exposure to elevated temperatures, ensuring consistent performance during operation.

Q2: How does the 15 W/(m·k) thermal conductivity affect overall performance in high-temperature systems?
A2: A thermal conductivity of 15 W/(m·k) facilitates even heat distribution, reducing localized temperature gradients. This property is crucial in systems where preventing thermal hotspots minimises component stress and prolongs service life.

Q3: What specific quality checks are performed during the manufacturing of the bonded ceramic composite?
A3: The product is subjected to real-time optical inspections and density measurements. These quality assessments confirm the uniform distribution of silicon carbide within the silicon nitride matrix, ensuring both mechanical integrity and consistent thermal performance.

Additional Information

Ceramic composites combining silicon nitride and silicon carbide are increasingly used in environments where high temperature and mechanical stress are prevalent. Their synthesis involves controlled sintering processes that optimise grain boundaries and minimise porosity. The resulting material exhibits a balanced profile of thermal conductivity and structural strength, which is critical for applications demanding precise thermal regulation.

Understanding the behaviour of ceramic composites under extreme conditions aids in designing systems that capitalise on their unique properties. Researchers and engineers benefit from insights into process optimisation and failure mechanisms, contributing to advancements in areas such as thermal management, machining accuracy, and overall system durability.