SC9935 Silicon Carbide Wafer Boat

Silicon Carbide Wafer Boat Description

Silicon Carbide (SiC) Wafer Boat is engineered as a ceramic carrier for semiconductor processing. Its composition featuring ≥99% purity and a density of ~2.7 g/cm³ ensures stable thermal and mechanical properties during high-temperature operations. The customizable dimensions allow integration into various processing setups, minimising thermal gradients and contamination risks. This design supports precise temperature control and maintains the integrity of sensitive wafer processing environments.

Silicon Carbide Wafer Boat Applications

1.       Semiconductor Processing
   - Used as a wafer carrier in high-temperature furnaces to minimise contamination by leveraging its chemical inertness.
   - Applied during epitaxial growth processes to maintain uniform thermal distribution by utilising its controlled density.

2.       Industrial Ceramic Applications
   - Serves as a structural component in advanced material processing systems to control thermal expansion through high-purity SiC.
   - Frequently used in laboratory furnaces where customizable design supports uniform heat distribution and process repeatability.

Silicon Carbide Wafer Boat Packing

The Silicon Carbide Wafer Boat is secured in anti-static, moisture-barrier bags and enclosed in rigid, cushioned boxes to mitigate mechanical impacts and contamination risks. It is stored in temperature-controlled conditions to preserve its ceramic integrity. The packaging design incorporates strict anti-dust measures, and options for customized labelling and compartmentalisation are available to meet specific handling requirements.

Frequently Asked Questions

Q1: How does the high-purity SiC composition influence performance during high-temperature processing?
A1: The high-purity SiC minimises the presence of impurities, reducing defect formation during extended high-temperature cycles and ensuring consistent thermal behaviour. This control over impurities is critical for maintaining process uniformity and reducing contamination risks in wafer processing.

Q2: What customisation options are available for the wafer boat dimensions?
A2: Dimensions can be tailored to suit different furnace configurations and wafer sizes. Adjustments to geometry help optimise thermal gradients and ensure compatibility with specific processing equipment, supporting precise integration into existing workflows.

Q3: How is the quality assurance process implemented during manufacturing?
A3: Quality assurance involves controlled sintering processes and optical inspection to monitor both density and compositional consistency. These inspections verify that each wafer boat meets the defined technical specifications required for high-temperature semiconductor applications.

Additional Information

Silicon carbide is extensively used in high-temperature and harsh environment applications due to its excellent thermal conductivity and chemical inertness. Its robustness under extreme conditions makes it a preferred choice for components that require resistance to thermal shock and degradation.

Advancements in sintering techniques and material engineering continue to enhance SiC properties, expanding its usefulness in semiconductor processing and industrial applications. The integration of precise manufacturing controls improves both dimensional accuracy and performance stability, aligning with the demands of modern high-temperature processing environments.