SC9938 Reaction Bonded Silicon Carbide Wafer Boat

Reaction Bonded Silicon Carbide Wafer Boat Description

Reaction Bonded Silicon Carbide Wafer Boat is manufactured using a controlled reaction-bonding process that enhances the microstructural integrity of SiC. With a material purity of ≥92% and a density of approximately 3.0 g/cm³, the product performs consistently in high-temperature environments up to 1300℃. Its boat form factor facilitates secure wafer handling during thermal processing, while customizable dimensions ensure compatibility with varied equipment configurations.

Reaction Bonded Silicon Carbide Wafer Boat Applications

1.       Semiconductor Manufacturing
   - Used as a carrier in furnace processing to achieve uniform thermal exposure by leveraging the reaction-bonded structure.

2.       Ceramic Processing
   - Applied as a sample holder in high-temperature treatments to promote dimensional stability and efficient thermal cycling through its controlled density.

Reaction Bonded Silicon Carbide Wafer Boat Packing

The Reaction Bonded Silicon Carbide Wafer Boat is securely packaged in contamination-resistant, anti-static materials and cushioned containers to prevent mechanical damage. Units are sealed with moisture barrier wrapping and stored in a dry, temperature-controlled environment. Custom packaging options, including tailored labelling and compartmentalisation, are available upon request to enhance handling and storage.

Frequently Asked Questions

Q1: How does the reaction bonding process contribute to the dimensional stability of the wafer boat in high-temperature operations?
A1: The controlled reaction bonding technique ensures a uniform phase distribution in the SiC, maintaining consistent density and dimensional accuracy during thermal cycling. This stability is vital for handling wafers in semiconductor processing.

Q2: What measures are taken to verify the material purity and density of the wafer boat?
A2: The fabrication process incorporates systematic microscopic inspections and density measurements to confirm that the material achieves a minimum of 92% purity and a density near 3.0 g/cm³, ensuring performance under high-temperature conditions.

Q3: Can the dimensions of the wafer boat be customised for specific processing equipment?
A3: Yes, the dimensions are fully customisable to accommodate various processing setups, ensuring compatibility with different high-temperature equipment while maintaining structural performance.

Additional Information

Silicon Carbide ceramics are valued for their high thermal stability and resistance to thermal shock, making them suitable for demanding industrial applications. Reaction bonding is a specialised process that enhances the material’s microstructure and performance under elevated temperatures by controlling phase development and density.

Advancements in ceramic processing techniques continue to improve reaction bonded materials, driving innovations in semiconductor and high-temperature processing equipment. Ongoing research focuses on optimising sintering conditions and minimising defects to extend the operational capabilities of SiC components in various industrial applications.