ST11165 Silver Planar Target, Ag Target

Silver Planar Target, Ag Target Description

Silver Planar Target, Ag Target is a sputtering target made from high-purity silver with a flat planar surface to ensure uniform thin film deposition. The customised dimensions meet the requirements of standard sputtering systems, facilitating consistent material transfer. Its controlled microstructure reduces localized erosion during plasma processing. These features are critical in achieving uniform coating thickness and stable process performance under rigorous deposition conditions.

Silver Planar Target, Ag Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Silver Planar Target, Ag Target Applications

Electronics
- Used as a sputtering target in semiconductor fabrication to deposit conductive silver layers. This approach addresses the need for precise film thickness by leveraging the target's uniform microstructure.

Industrial Coatings
- Applied as a functional component in surface coating processes to achieve consistent reflectivity and conductivity. Its refined material properties reduce processing variations and improve end-product performance.

Silver Planar Target, Ag Target Packing

The Silver Planar Target, Ag Target is packaged in an anti-static container lined with foam to prevent mechanical damage. It is wrapped in moisture barrier film and sealed with desiccants to minimise contamination. Packaging is designed to maintain a controlled environment during transport and storage. Customised packaging options, including cleanroom-grade materials and specific labelling, are available upon request.

Additional Information

Silver sputtering targets play a crucial role in thin film deposition technologies, where maintaining material purity and surface uniformity is essential. The properties of silver, such as high electrical and thermal conductivity, make it suitable for applications in electronics and decorative coatings. Advanced analytical techniques, including X-ray diffraction and electron microscopy, are standard practices to assess target quality and microstructure.

A comprehensive understanding of silver's physical and chemical characteristics supports process calibration and improves deposition efficiency in industrial environments. Continuous advancements in material processing and quality control facilitate the production of targets that meet stringent performance requirements in modern sputtering systems.