ST11173 Sodium Phosphate Sputtering Target, Na3PO4 Target

Sodium Phosphate Sputtering Target, Na3PO4 Target Description

Sodium Phosphate Sputtering Target, Na3PO4 Target is composed of high-purity Na3PO4 in a target form suitable for sputtering processes. The material's uniform chemical composition supports consistent deposition rates and film properties. Its fabrication involves stringent process controls, ensuring minimal impurities and defects, which is crucial for applications requiring uniform thin films in semiconductor and optical device manufacturing.

Sodium Phosphate Sputtering Target, Na3PO4 Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Sodium Phosphate Sputtering Target, Na3PO4 Target Applications

Electronics and Display Manufacturing
- Used as target material in thin film deposition for display panels to achieve uniform, high-integrity coating by leveraging its chemical stability.
- Applied in the fabrication of transparent conductive films where controlled composition ensures consistent optical and electrical properties.

Industrial Coatings and Sensors
- Employed as a reactive sputtering target in sensor manufacturing to achieve functional film layers by taking advantage of its controlled microstructure.
- Frequently used in protective coating processes where chemical inertness supports long-term film durability under operational stresses.

Sodium Phosphate Sputtering Target, Na3PO4 Target Packing

The target is securely packaged in an anti-static, moisture-resistant enclosure with cushioning materials to prevent mechanical damage during transit. Storage guidelines include a temperature and humidity-controlled environment to maintain material integrity. Packaging options can be customised with additional sealing or labelling to meet specific laboratory or production requirements.

Additional Information

Sodium phosphate sputtering targets are critical components in thin film deposition, where precise film uniformity heavily depends on the target's purity and microstructure. The sputtering process itself relies on maintaining a stable plasma environment, and materials with consistent chemical characteristics ensure repeatable deposition cycles.

In the broader context of material science, understanding the relationship between chemical composition and film properties is essential. Research continues to refine target formulations to optimise sputtering efficiency, reduce particulate generation, and enhance overall film performance in advanced electronic and optical devices.