ST11177 Cobalt Rotary Target, Co Target

Cobalt Rotary Target, Co Target Description

Cobalt Rotary Target, Co Target is a sputtering target made from high-purity cobalt (Co) designed for physical vapour deposition processes. The target's rotary mechanism promotes even erosion, thereby enhancing film uniformity on substrates. Its specification in customised dimensions supports compatibility with various deposition systems. The controlled microstructure and chemical composition provide consistent performance in manufacturing applications where precise thin film deposition is critical.

Cobalt Rotary Target, Co Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Cobalt Rotary Target, Co Target Applications

Electronics Manufacturing
- Used as a sputtering target in semiconductor fabrication to achieve uniform thin film deposition by utilising cobalt's defined erosion characteristics.

Industrial Processes
- Applied as a cathodic target in coating systems designed to build up wear-resistant layers by utilising the material's predictable sputtering behaviour.
- Serves as a component in magnetron sputtering setups where consistent target erosion contributes to controlled film thickness and improved device performance.

Cobalt Rotary Target, Co Target Packing

The target is packaged in clean-room grade, anti-static, and moisture-barrier materials to prevent contamination. It is sealed within cushioned, inert gas-filled containers to avoid oxidation and mechanical damage. Storage conditions require low humidity and temperature control. Custom packaging solutions, including foam inserts and specific labelling, are available to address unique handling and transit requirements.

Additional Information

Sputtering targets are critical components in physical vapour deposition, where material uniformity and predictable erosion directly impact film quality. Cobalt, with its defined physical and chemical properties, is widely utilised in applications requiring durable and consistent coatings. The rotary design further enhances target efficiency by distributing the sputtering load evenly across the surface.

Recent advances in deposition technology continue to refine the use of metallic targets such as cobalt, promoting improved film adhesion and uniformity in semiconductor and electronic applications. Understanding the interplay between material properties and process parameters is essential for optimising deposition outcomes and enabling technological innovations across multiple industrial sectors.