ST11180 Chromium Planar Target, Cr Target

Chromium Planar Target, Cr Target Description

Chromium Planar Target, Cr Target is a sputtering source manufactured from high-purity chromium metal. It is designed for use in physical vapour deposition processes to form uniform thin films. The planar configuration supports consistent material output and precise film thickness control. Its customised dimensions enable compatibility with standard sputtering equipment while maintaining a smooth deposition surface and stable element composition, which is critical for semiconductor and optical coating applications.

Chromium Planar Target, Cr Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Chromium Planar Target, Cr Target Applications

Electronics and Semiconductor Manufacturing
- Used as the metal source in sputtering systems to form conductive layers in integrated circuits by utilising the target's consistent composition.
- Applied as the deposition material in flat panel display production to achieve uniform film coverage and reduced particulate interference.

Industrial Surface Coatings
- Serves as a coating element on mechanical components to provide a protective metallic layer by utilising its stable material properties.
- Used as a source in decorative coating systems to produce uniform and adherent chromium films on consumer products.

Chromium Planar Target, Cr Target Packing

The target is packaged in a clean, static-free environment using anti-contamination wrapping. It is sealed in moisture-resistant, custom-fit containers with protective cushioning that minimises handling damage. Storage instructions emphasise a controlled temperature environment and minimal exposure to dust or airborne particles. Customised packaging options, including labelled and compartmentalised units, are available to meet specific logistics requirements.

Additional Information

Chromium-based sputtering targets have long been used in environments requiring controlled thin film deposition. Their material properties, including high melting point and moderate electrical resistivity, make them suitable for applications where thermal and mechanical stability are essential. 

Understanding the processing conditions and target morphology plays a significant role in the overall performance of physical vapour deposition systems. Continuous research in material science aids in refining these targets to meet advanced engineering challenges in both semiconductor manufacturing and industrial coating processes.