ST11182 Copper Aluminum Rotary Target, CuAl Target

Copper Aluminium Rotary Target, CuAl Target Description

Copper Aluminium Rotary Target, CuAl Target is a sputtering target made from a copper-aluminium alloy configured in a rotary design. Its customised dimensions ensure compatibility with a range of sputtering equipment. The target's rotary motion minimises erosion anomalies and enhances uniform thin film deposition. Developed through precise metallurgical control, the product meets technical requirements in applications requiring consistent deposition and process stability.

Copper Aluminium Rotary Target, CuAl Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Aluminium Rotary Target, CuAl Target Applications

Electronics
- Use as a sputtering target in semiconductor deposition systems to achieve uniform thin film coatings by leveraging the rotary design and controlled alloy composition. 

Industrial Coatings
- Applied as the active component in physical vapour deposition (PVD) systems to provide consistent and repeatable film characteristics, addressing issues of localised wear and ensuring even coating thickness.

Display Manufacturing
- Serves as the source material in the production of display panels to enhance layer uniformity and improve overall process control during vacuum deposition.

Copper Aluminium Rotary Target, CuAl Target Packing

The target is packaged in static-free anti-contamination wrapping and cushioned with inert foam inserts to prevent mechanical shocks. It is sealed in moisture-resistant, low-particulate containers, ensuring safe transport and long-term storage. Packaging options can be customised to include additional labelling and compartmentalisation for specific handling and process requirements.

Additional Information

The use of sputtering targets like the Copper Aluminium Rotary Target, CuAl Target is integral to thin film deposition processes in electronics and industrial applications. These targets must meet stringent compositional and mechanical specifications to achieve uniform film properties during vacuum deposition. Detailed metallurgical characterisation and real-time process monitoring are essential elements in managing material quality and performance.

Advancements in materials science have led to the development of specialised sputtering targets engineered for high-volume processing and consistency. Understanding the interplay between alloy composition, rotational mechanics, and deposition dynamics helps optimise system integration and overall process efficiency for various industrial applications.