ST11183 Copper Gallium Rotary Target, CuGa Target

Copper Gallium Rotary Target, CuGa Target Description

Copper Gallium Rotary Target, CuGa Target is fabricated from a copper-gallium alloy with strictly controlled elemental composition. The target's customisable dimensions allow integration with standard sputter deposition systems while ensuring even material erosion during operation. This formulation supports consistent plasma conditions and uniform film build-up during deposition processes, making it suitable for industrial-scale applications where material stability and precise erosion behaviour are essential.

Copper Gallium Rotary Target, CuGa Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Gallium Rotary Target, CuGa Target Applications

Electronics
- Used as a sputtering source in semiconductor deposition systems to achieve uniform film thickness by leveraging a controlled alloy composition.
- Applied as a material source in display panel manufacturing to maintain consistent electrical characteristics through customised target dimensions.

Industrial
- Serves as a sputtering target in coating systems for automotive components to achieve even material erosion by utilising precise alloy formulation.
- Utilised in industrial surface treatment equipment to obtain stable plasma conditions through controlled microstructure and compositional consistency.

Copper Gallium Rotary Target, CuGa Target Packing

The target is secured in a foam-lined, anti-static container with a moisture barrier to minimise environmental contamination. The packaging is sealed and labelled with detailed alloy composition and custom dimensions. It is recommended for storage in a dry, temperature-controlled environment to prevent material degradation. Options for tamper-evident seals and additional cushioning are available to suit specific handling requirements.

Additional Information

Copper-gallium alloys combine the inherent thermal and electrical properties of copper with the modified characteristics introduced by gallium. The precise control of elemental composition is critical in tuning the sputtering behaviour necessary for uniform film growth in thin-film deposition applications.

Understanding the interaction between alloy microstructure and erosion behaviour aids in designing targets for specific industrial processes. Detailed characterisation techniques such as spectroscopy and electron microscopy provide insight into the material's performance under operational stresses, offering a basis for informed material selection in deposition systems.