ST11184 Copper Indium Gallium Planar Sputtering Target, CIG Target

Copper Indium Gallium Planar Sputtering Target, CIG Target Description

Copper Indium Gallium Planar Sputtering Target, CIG Target is a sputtering material formulated with a precise alloy of copper, indium, and gallium. The target's customisable dimensions facilitate integration with various deposition systems ensuring compatibility with standard semiconductor process equipment. Its well-controlled microstructure aids in achieving uniform film characteristics and supports optimised film adhesion and morphology for advanced thin film applications.

Copper Indium Gallium Planar Sputtering Target, CIG Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Indium Gallium Planar Sputtering Target, CIG Target Applications

Electronics and Semiconductors
- Used as a sputtering source in semiconductor deposition systems to achieve uniform thin film coatings by leveraging customisable dimensions.
- Applied as the material source in photovoltaic cell production to regulate film morphology through controlled alloy composition.

Industrial Microfabrication
- Serves as the deposition target in microfabrication processes for integrated circuit interconnects to enhance film uniformity by utilising precise compositional control.
- Frequently used for coating processes in electronic packaging, where tailored dimensions improve film quality and device performance.

Copper Indium Gallium Planar Sputtering Target, CIG Target Packing

The Copper Indium Gallium Planar Sputtering Target is packaged in a foam-lined, anti-static container to protect against mechanical shock and particulate contamination. The target is sealed in inert atmosphere packaging to limit exposure to moisture and airborne contaminants. It is advised to store the target in a controlled environment with stable temperature and humidity. Customised packaging options are available to satisfy specific handling and transportation needs.

Additional Information

Sputtering targets are critical in advanced thin film deposition, influencing film properties and device performance. The material properties, such as composition, density, and surface morphology, play essential roles in determining the sputtering yield and film uniformity. Adjusting these parameters can optimise the deposition process for specific semiconductor and photovoltaic applications.

Understanding the interplay between alloy composition and deposition parameters is vital in materials science. Research continues to focus on refining sputtering techniques to achieve consistent film thickness and microstructural control across various industrial applications, driving improvements in both performance and manufacturing efficiency.