ST11185 Copper Manganese Rotary Target, CuMn Target

Copper Manganese Rotary Target, CuMn Target Description

Copper Manganese Rotary Target, CuMn Target is fabricated from a copper-manganese alloy with precisely controlled composition to optimise sputtering performance. Its customisable dimensions allow compatibility with a range of sputtering equipment used in semiconductor and thin-film production. The target's stable alloy characteristics help achieve uniform film deposition whilst minimising particulate generation. This material is specifically processed for consistent performance in industrial and research applications.

Copper Manganese Rotary Target, CuMn Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Manganese Rotary Target, CuMn Target Applications

Electronics
- Used as a sputtering source in semiconductor deposition to achieve uniform conductive layers by leveraging controlled alloy composition.
- Applied as a coating target in production systems to improve film adhesion and conductivity through tailored material properties.

Industrial
- Serves as the deposition material in thin-film coating equipment to generate consistent surface finishes by mitigating localised erosion.
- Frequently used in manufacturing processes requiring uniform metallic layers, enhancing the performance of decorative and functional coatings.

Copper Manganese Rotary Target, CuMn Target Packing

The target is packaged in static-dissipative wrapping and sealed in a moisture-resistant container with an anti-scratch foam insert. Protective measures prevent particulate contamination and mechanical damage during transport and storage. Storage in a clean, temperature-controlled, and dry environment is recommended. Custom packaging options, including tamper-evident seals and labelling, are available upon request to meet specific handling procedures.

Additional Information

Copper-manganese alloys are extensively studied due to their interesting phase behaviour and microstructural properties. Adjustments in composition and processing conditions can lead to variations in grain structure and thermal stability, which are critical in sputtering applications. 

In industrial thin-film deposition, understanding the interaction between plasma dynamics and material properties is essential. Research continues to optimise sputtering targets for improved deposition uniformity and process efficiency, directly impacting device performance and manufacturing yields.