ST11186 Copper Nickel Titanium Rotary Target, CuNiTi Target

Copper Nickel Titanium Rotary Target, CuNiTi Target Description

Copper Nickel Titanium Rotary Target, CuNiTi Target is fabricated from a high-purity copper alloy containing well-defined percentages of nickel and titanium. The target is produced with customised dimensions to integrate with standard sputtering equipment. Its controlled alloy composition and calibrated microstructure permit stable erosion during sputtering, ensuring uniform film deposition. The material properties are optimised to mitigate particulate formation and enhance process repeatability, which benefits applications in semiconductor and coating industries.

Copper Nickel Titanium Rotary Target, CuNiTi Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Nickel Titanium Rotary Target, CuNiTi Target Applications

Electronics
- Used as a sputtering target in semiconductor thin film deposition to achieve uniform film growth by leveraging precise alloy composition.
- Applied as a material source in advanced coating systems to promote consistent film density using controlled microstructural features.

Industrial Manufacturing
- Serves as a coating material component in surface treatment systems to enhance wear resistance by utilising calibrated material properties.
- Used in research setups for assessing new deposition techniques that require tailored target performance.

Copper Nickel Titanium Rotary Target, CuNiTi Target Packing

The target is packaged in anti-static, moisture-resistant containers lined with inert foam to minimise mechanical impacts during transit and storage. Protective wrapping prevents contamination and oxidation. Storage should be in a controlled environment with stable temperatures. Custom packaging options, including vacuum-sealed pouches and compartmentalised crates, are available to meet specific handling requirements.

Additional Information

Copper-based alloys, such as the CuNiTi composition, are vital in sputtering technology due to their controlled erosion behaviour and stable physical properties. In deposition processes, the precise alloy makeup reduces particulate generation and maintains uniform target wear. Understanding these material interactions is critical for optimising thin film deposition systems in various industrial applications.

Advances in metallurgical processing and quality control continue to refine the performance of sputtering targets. Detailed microstructural evaluations and compositional adjustments allow researchers and engineers to customise targets for specific applications, ensuring that material behaviour aligns with process demands and contributes to enhanced film characteristics.