ST11187 Copper Titanium Rotary Target, CuTi Target

Copper Titanium Rotary Target, CuTi Target Description

Copper Titanium Rotary Target, CuTi Target is a sputtering target composed of a copper-titanium alloy optimised for uniform film deposition. Its controlled microstructure and engineered composition promote even target erosion in rotary systems, enhancing thin-film uniformity. The design supports consistent sputtering performance and improved coating adhesion in physical vapour deposition processes, making it suitable for precision applications in material processing.

Copper Titanium Rotary Target, CuTi Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Copper Titanium Rotary Target, CuTi Target Applications

Electronics
- Used as a sputtering source in semiconductor deposition systems to achieve uniform thin films by leveraging its controlled microstructure. Enhances layer consistency and reduces defects.

Industrial
- Applied as a target in physical vapour deposition for hard coatings on machining tools to improve surface wear resistance by utilising its stable copper-titanium bonding properties.

Automotive
- Used in coating processes for automotive components to enhance corrosion resistance by capitalising on its predictable erosion behaviour and chemical stability.

Copper Titanium Rotary Target, CuTi Target Packing

The target is packaged in a sealed, anti-static container with a foam insert to minimise mechanical shock and contamination. It is stored in a temperature-controlled, low-humidity environment to prevent oxidation. Additional measures such as moisture barriers and custom labelling are available to accommodate specific handling requirements and extend product shelf life.

Additional Information

Copper-titanium alloys combine the electrical conductivity of copper with the strength and high-temperature resilience of titanium. These alloys are frequently used in sputtering applications due to their ability to maintain consistent performance under continuous plasma exposure. The precise control of alloy composition is critical to achieving uniform deposition and minimising target erosion.

Understanding the interplay between material properties and sputtering performance is fundamental in materials science. The integration of rigorous quality control measures during target fabrication helps ensure that long-term deposition processes meet stringent durability and uniformity specifications required by advanced industrial fabrication systems.