ST11195 Molybdenum Carbide Planar Target, Mo2C Target

Molybdenum Carbide Planar Target, Mo2C Target Description

The Molybdenum Carbide Planar Target, Mo2C Target is manufactured from molybdenum carbide (Mo2C), a compound known for its high thermal and chemical stability. The target's planar design ensures that sputtering yields films with consistent thickness and uniform microstructure. This attribute is essential for applications requiring tight tolerances in film deposition, making it suitable for precise thin film fabrication processes.

Molybdenum Carbide Planar Target, Mo2C Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Molybdenum Carbide Planar Target, Mo2C Target Applications

Electronics and Semiconductor Processing
- Used as a sputtering target in semiconductor fabrication to achieve uniform conductive films by leveraging its consistent composition and flat surface.
- Applied in thin film deposition for monitoring sensor components to ensure accurate film thickness and density.

Industrial Coating and Surface Engineering
- Serves as the source material in physical vapour deposition systems to provide protective coatings with controlled microstructure by employing its high thermal stability.
- Frequently used in coating tools and components to improve surface hardness while minimising contamination risks.

Molybdenum Carbide Planar Target, Mo2C Target Packing

The target is packaged in a vacuum-sealed, anti-static container with cushioning foam inserts to minimise mechanical stress and contamination. Packaging is designed for storage under controlled ambient conditions to maintain material integrity. Custom packaging options, such as tailored dimensions and labelling, are available to suit specific handling and storage requirements.

Additional Information

Molybdenum carbide is noted for its excellent thermal stability and chemical resistance, making it a common choice for high-temperature sputtering environments. Its properties are crucial for establishing stable deposition conditions in applications where uniformity directly influences thin film performance.

In sputtering processes, the material's compatibility with various substrates and its consistent behaviour under high-energy plasma conditions are key factors. This product fits into a broader category of sputtering targets where controlled microstructures and composition enhance overall device fabrication efficiency.