ST11203 Nickel Copper Rotary Target, NiCu Target

Catalogue Number	ST11203
Composition	Ni, Cu
Purity	≥99.9%, or customized
Form	Target
Shape	Tubular
Dimensions	Customized

Nickel Copper Rotary Target, NiCu Target is an alloy target engineered for sputtering applications. It is fabricated using refined manufacturing techniques at Stanford Advanced Materials (SAM). SAM employs quantitative elemental analysis and in-line spectrometric quality control to maintain composition accuracy. The product undergoes thorough evaluation of microstructural uniformity and surface finish to optimise deposition consistency in industrial sputtering processes.

INQUIRY

Description

Specification

Reviews

FAQ

How does the composition control of the NiCu Target affect sputtering performance?

Precise composition control ensures that the sputtered films exhibit uniform elemental distribution and microstructure. This minimises variation in film properties, which is essential for reproducible deposition processes in semiconductor manufacturing.

What are the critical steps in the surface preparation of the rotary target?

The target surface is mechanically polished and chemically etched to remove imperfections. This treatment enhances film adhesion and reduces particulate contamination during sputtering. Contact us for precise process parameters.

Can the target dimensions be customised for specific deposition systems?

Yes, the target dimensions are customised based on client requirements. Tailored sizing allows compatibility with different sputtering systems, ensuring efficient material usage and deposition consistency.

REQUEST A QUOTE

Send us an inquiry today to learn more and receive the latest pricing. Thank you!