ST11204 Nickel Niobium Rotary Target, NiNb Target

Nickel Niobium Rotary Target, NiNb Target Description

Nickel Niobium Rotary Target, NiNb Target is manufactured from a controlled nickel-niobium alloy intended for sputtering applications. Its customised dimensions support compatibility with standard sputtering systems, while the rotary design promotes even material erosion during operation. The controlled alloy composition minimises impurities and supports uniform deposition, making it suitable for applications in semiconductor and thin-film processing.

Nickel Niobium Rotary Target, NiNb Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Nickel Niobium Rotary Target, NiNb Target Applications

Electronics
- Used as a sputtering target in semiconductor thin-film deposition to achieve uniform film properties by leveraging a controlled alloy composition.

Industrial
- Employed in vacuum coating systems for display panels and sensors to enhance layer consistency and target longevity by utilising a rotary design.
- Applied in surface modification processes for non-ferrous metal components to improve wear resistance through even erosion profiles.

Nickel Niobium Rotary Target, NiNb Target Packing

The target is packed in an anti-static, foam-lined container to protect against mechanical shock and contamination. Packaging materials ensure minimal exposure to environmental factors and maintain stable storage conditions. The product is enclosed in sealed, moisture-resistant wrapping, with options for customised labelling and compartmentalised inserts for multiple targets. Storage in a dry, temperature-controlled environment is recommended to preserve quality.

Additional Information

Nickel-niobium alloys are studied for their balanced physical and mechanical properties, which make them suitable for sputtering targets. The controlled alloy composition enhances the microstructural uniformity essential for consistent deposition processes. Analytical techniques, including X-ray diffraction and scanning electron microscopy, are routinely applied to monitor phase composition and structural properties.

Understanding the interaction between target material and sputtering system parameters is crucial for optimising deposition efficiency. Advances in rotary target design contribute to extended operational life and uniform sputtered films, meeting the evolving demands of semiconductor manufacturing and industrial coating processes.