ST11205 Nickel Vanadium Rotary Target, NiV Target

Nickel Vanadium Rotary Target, NiV Target Description

Nickel Vanadium Rotary Target, NiV Target is engineered for magnetron sputtering applications, facilitating the deposition of nickel-vanadium films with controlled properties. The target's customisable dimensions allow integration with diverse sputtering systems, ensuring that film thickness and uniformity meet rigorous process requirements. The inherent chemical stability of the nickel-vanadium alloy supports applications where film integrity and precision are critical. Enhanced surface finishing minimises particulate contamination during deposition.

Nickel Vanadium Rotary Target, NiV Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Nickel Vanadium Rotary Target, NiV Target Applications

Electronics
- Used as a sputtering target in semiconductor fabrication to achieve uniform thin film deposition by leveraging customisable dimensions.

Industrial
- Applied as a coating source in tribological systems to reduce wear by utilising the target's controlled alloy composition.

Commercial
- Serves as a target in decorative plating systems to achieve consistent surface finishes by harnessing precise film deposition control.

Nickel Vanadium Rotary Target, NiV Target Packing

Nickel Vanadium Rotary Targets are packaged in protective, foam-lined stainless steel containers that minimise physical damage during transit and storage. The packaging includes an inert gas atmosphere to reduce oxidation risks and employs moisture barrier materials to prevent contamination. Storage under controlled temperature and humidity conditions is recommended. Custom packaging solutions, such as anti-static and vacuum-sealed options, are available upon request to meet specific handling requirements.

Additional Information

Nickel-vanadium alloys are widely utilised in sputtering applications due to their stable physical properties and consistent performance under plasma conditions. Understanding the interplay between target composition and sputtering parameters is essential for achieving uniform film deposition in manufacturing processes.

The choice of materials for sputtering targets significantly affects the quality of thin films produced in industries ranging from semiconductor manufacturing to decorative coatings. Research into alloy behaviour under prolonged sputtering conditions continues to improve process efficiencies and material performance in various industrial settings.