ST11206 Lead Planar Target, Pb Target

Lead Planar Target, Pb Target Description

Lead Planar Target, Pb Target is a sputtering target primarily composed of lead (Pb) that features customizable dimensions to meet specific deposition requirements. Its planar geometry supports uniform sputtering crucial for consistent thin film production. Manufactured through controlled metallurgical processes and surface inspections, this target aids in achieving optimised deposition thickness and homogeneity, suitable for advanced research and industrial sputtering applications.

Lead Planar Target, Pb Target Characteristics

*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Lead Planar Target, Pb Target Applications

Electronics
- Used as a sputtering source in semiconductor interconnect fabrication to achieve uniform Pb film deposition by leveraging its planar geometry.
- Applied in sensor device manufacturing to deposit lead films with controlled thickness, enhancing device sensitivity.

Industrial
- Employed as a coating source in the production of corrosion-resistant layers on industrial components, optimising film uniformity through controlled sputtering.

Research
- Frequently used in R&D settings for experimental thin film studies to assess the impact of customised target dimensions on deposition behaviour, enabling the refinement of process parameters.

Lead Planar Target, Pb Target Packing

Lead Planar Target, Pb Target is packaged in antistatic and moisture-resistant containers with moulded foam inserts for mechanical protection. The packaging minimises contamination risks through sealed polybags and rigid outer boxes. Custom labelling and batch traceability options are available. The product should be stored in a clean, dry environment at controlled ambient conditions to maintain its surface integrity during transport and storage.

Additional Information

Sputtering targets play a critical role in thin film deposition techniques, with planar targets ensuring uniform plasma distribution and consistent film qualities. Understanding the interplay between target material properties and plasma dynamics is essential when optimising deposition parameters in various industrial, electronic, and research applications.

Advancements in materials science have refined the production of sputtering targets, focusing on surface flatness, purity, and dimensional accuracy. These factors contribute significantly to process stability and film uniformity, which are vital for applications requiring precise layer deposition in microelectronics and sensor technologies.