ST11209 Silicon Sputtering Target, Si Target

Silicon Sputtering Target, Si Target Description

Silicon Sputtering Target, Si Target is manufactured from high-purity silicon metal and intended for use in physical vapour deposition systems. The target's customisable dimensions ensure compatibility with standard equipment in semiconductor fabrication. Its composition and structure are engineered to support the uniform deposition of silicon films, reducing process variability in thin film coating applications.

Silicon Sputtering Target, Si Target Characteristics

The above product information is based on theoretical data and is for reference only. Actual specifications may vary.

Silicon Sputtering Target, Si Target Applications

Electronics and Semiconductor Manufacturing
- Used as the deposition source in sputtering systems to achieve uniform silicon film formation by leveraging controlled purity and customisable dimensions.
- Applied as the active target in thin film transistors to control film thickness and enhance device performance through consistent material properties.

Industrial Coating Processes
- Serves as the sputtering medium in coating systems to form protective layers by utilising its measured composition and structural consistency, reducing film stress during deposition.
- Employed in solar cell fabrication to deposit intrinsic silicon layers, contributing to improved photovoltaic efficiency by ensuring uniform material deposition.

Silicon Sputtering Target, Si Target Packing

Silicon Sputtering Target, Si Target is packaged in a clean, sealed plastic container with anti-static foam inserts to prevent mechanical damage and contamination. Packaging is designed to exclude dust and moisture, ensuring storage in a controlled, low-humidity environment. Custom packing options such as vacuum-sealed packages or cushioned crates are available to accommodate specific handling requirements.

Additional Information

Silicon targets used in sputtering are a fundamental component in the deposition of thin films, essential in semiconductor and microelectronic fabrication. Their controlled purity, consistent composition, and customisable dimensions allow for precise tailoring of electronic properties in deposited films. Research continues to refine sputtering techniques, emphasising defect reduction and film uniformity.

The production process of silicon sputtering targets involves careful assessment of material characteristics such as density and melting point. Understanding these parameters aids in optimising the sputter deposition process, which plays a critical role in manufacturing devices with high-performance electrical characteristics.